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Bi2Ti2O7薄膜的反应离子刻蚀及原子力显微镜研究

The Reactive Ion Etching of Bi2Ti2O7 Thin Films on Silicon Substrates and Its Image in Atomic Force Microscopy

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【作者】 王卓孙大亮胡季帆许效红王栋王民王弘王春雷陈焕矗房昌水刘训春魏珂

【Author】 WANG Zhuo;SUN Da-liang;HU Ji-Fan;XU Xiao-houg; WANG Dong;WANG Min;WANG Hong;WANG Chun-lei;CHEN HUan-chu;FANG Chang-shui;LIU Xun-chun;WEI Ke State Key Lab. of Crystal Materials, Shandong University Jinan, 250100, China Department of Physics,Shandong University Jinan, 250100, China Microelectronics R&Chinese Academy of Science, 650Mailbox,Beijing, 100010, China

【机构】 山东大学晶体材料国家重点实验室山东大学物理系中国科学院微电子中心

【摘要】 采用金属有机化合物分解(MOD)法制备出Bi2Ti2O7介电薄膜.然后在560℃退火30min得到(111)取向的Bi2Ti2O7薄膜.首次成功地对Bi2Ti2O7薄膜进行了反应离子刻蚀,使用的气体分别为氧气(O2)、六氟化硫气体(SF6)、三氟甲烷气体(CHF3)以及SF6/CHF3混合气体.采用原子力显微镜和X射线衍射对退火前后的Bi2Ti2O7薄膜的形貌和结构进行了对比分析.结果表明,退火前Bi2Ti2O7薄膜为多晶薄膜,晶粒间距松散,无定型取向.退火后的薄膜中,结晶微粒排列紧密,呈现出较强的取向性.原子力显微镜图像还显示出薄膜生长的各向异性.

【Abstract】 Bismuth titanate thin films have been prepared on silicon substrates by metal-organic deposition (MOCVD)method. The growth procedure of the Bi2Ti2O7 thin films using O2, SF6,CHF3 and SF6/CHF3 gas mixture respectivelywere alsostudied by changing the etching gas composition, pressure, flux and power in a parallel-plate reactive ionetcher. The thickness of the Bi2Ti2O7thin films was measured by using Dektak Ⅱ step-meter. And the uniformity of thethickness of the thin film on three inches silicon plate was also detemined. The surface morphology and growthmechanism of the Bi2Ti2O7 thin films were studied by atomic force microscope (AFM). It is elucidated that Bi2Ti2O7film obviously has its growing anisotropy after annealing at 560℃.

【基金】 国家自然科学基金(59832080);中国国家青年骨干教育基金
  • 【会议录名称】 第四届中国功能材料及其应用学术会议论文集
  • 【会议名称】第四届中国功能材料及其应用学术会议
  • 【会议时间】2001-10
  • 【会议地点】中国厦门
  • 【分类号】TB383
  • 【主办单位】中国仪器仪表学会仪表材料分会
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