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化学溶液法制备PZT/Bi2Ti2O7薄膜的形貌和物理性质

Surface Morphology and Physical Properties of PZT/ Bi2Ti2O7/Si Thin FiIms Prepared by Chemical Solution Decomposition

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【作者】 尚淑霞姚伟峰王少伟许效红候云王弘余金中

【Author】 SHANG Shu-xia;YAO Wei-feng;WANG Shao-wei;XU Xiao-hong;HOU Yun;WANG Hong;YU Jin-zhong State Key Laboratory of Crystal Materials, Shandong University Jinan, 250100, China State Key Laboratory on Integrated Optoelectronics, Beijing, 100084, China

【机构】 山东大学晶体材料国家重点实验室中国科学院集成光电子国家重点实验室

【摘要】 采用化学溶液沉积法在硅(100)衬底上制备了以Bi2Ti2O7为隔离层的PZT铁电薄膜,研究测量了退火温度、时间对薄膜的晶体结构和表面形貌的影响,结果表明,在750℃退火10min可以得到结晶性较好、具有单一钙钛矿结构PbZr0.5Ti0.5O3的薄膜。薄膜表面无裂纹、晶粒排列致密、晶粒大小及分布均匀。薄膜的介电常数为59.4,介电损耗为0.016.偏压从-10~10V,记忆窗口为2V。外加电压达11V时,漏电流密度为1.28×10-8A/cm2。说明薄膜的绝缘性很好。PZT/Bi2Ti2O7/Si 薄膜适合于制备新型铁电场效应器件。

【Abstract】 PZT thin film have be prepared by chemical solution decomposition technique on Si(100) substrate using aBi2Ti2O7 film as a buffer layer.The influence of annealing temperature and time on the crystalline and surfacemorphology of PZT films were studied. The result indicate that,the PZT/Bi2Ti2O7/Si films annealed at 750℃ for 30minutes have single perovskite phase. The surface of the film is smooth and no slits. The film is dense with uniformgains. The dielectric constant is 59.4 and the loss tanδ is 0.016, the memory window is 2V,the leakage current is1.28×10-8A/cm2 when a applied voltage is 11V.These results show the PZT/ Bi2Ti2O7/Si films high insulatingproperties and suitable for making new FEFETS devices.

  • 【会议录名称】 第四届中国功能材料及其应用学术会议论文集
  • 【会议名称】第四届中国功能材料及其应用学术会议
  • 【会议时间】2001-10
  • 【会议地点】中国厦门
  • 【分类号】TB43
  • 【主办单位】中国仪器仪表学会仪表材料分会
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