【作者】 王丽风； 孙凤莲； 刘晓晶； 刘洋；

【Author】 Wang lifeng Sun fenglian Liu Xiaojing Liu yang.College of Material Science & Engineering,Harbin university of Science and Technology,Harbin 150080

【机构】 哈尔滨理工大学 材料工程与控制学院；

【摘要】 环保和微电子器件高度集成化的发展驱动了高性能无铅焊料的研究和开发。借助于 Thermo-Calc 热力学计算软件,设计了 SnAgCuBi 无铅焊料合金,采用 Scheil 模型模拟了液态焊料的快速凝固过程,并与目前通用的 SnAgCu 进行了对比试验及 SEM 利 EDX 分析。SnAgCuBi 基体组织比较细小,Bi 以单质形式弥散析出,与 Cu 焊盘反应所形成的焊点 IMC 为 Cu₆Sn₅,老化后,在靠近 Cu 焊盘一侧形成了薄薄的一层 Cu₃Sn。时效后 Bi 颗粒在靠近 SnAgCuBi／Cu 界面处发生了聚集现象并粗化,随着时效时间的增加,接头 IMC 逐渐趋于平缓,IMC 厚度增加,同等时效条件下,SnAgCuBi 合金焊接接头界面处化合物层的厚度要小于 SnAgCu 合金。更多还原

【Abstract】 The R&D of the lead-free solder of high performance has been pushed forward by the highly developed environment conservation and integrated microelectronic devices.SnAgCuBi new alloy was studied and assessed by means of theoretical calculation.The solidification process was simulated according to the Scheil-Gulliver model.Contrast experiment and S E Mand E D X analysis were Carried on.Compared to SnAgCu eutectic alloy,the matrix grains of SnAgCuBi were smaller.Bi separates out by the simple substance form dissemination.The IMC（intermetallic compound）at the interface was Cu₆Sn₅.After aging a thin layer of Cu₃Sn was found near Cu pad.During aging,the dispersed Bi in the solder matrix concentrated at the interface.With the increasing of aging time,the IMC layer at the interface tended to be flat and continuous,growing thicker.By comparing,the thickness of IMC layer at interface between SnAgCuBi and Cu was smaller than that of SnAgCu/Cu although under the same processing condition.更多还原