【作者】 齐会民； 王春兰； 高金淼； 黄发荣； 杜磊；

【Author】 QI Huimin, WANG Chunlan, GAO Jinmiao, HUANG Farong, DU Lei (Key Laboratory for Special Functional Polymer Materials and Related Techniques of Ministry of Education, East China University of Science and Technology, Shanghai 200237, P. R. China)

【机构】 华东理工大学特种功能高分子材料及相关技术教育部重点实验室；

【摘要】 含硅芳炔树脂(PSA-R)具有优异的耐高温、优良的介电性能、高温力学性能,以及优异的工艺性能,适用于RTM成型工艺,在航空航天、电子信息领域有广泛的应用。本文用动态差示扫描量热法(DSC)研究了含硅芳炔树脂的固化反应,试验表明含硅芳炔树脂的固化动力学符合n-级固化反应模型,固化反应级数约为2级,反应活化能为110KJmol-1。用平板流变仪研究了PSA-R树脂的动态粘度及等温粘度变化,研究了凝胶时间与温度的关系,建立了凝胶模型和粘度模型,该模型预测粘度与实验结果相吻合。更多还原

【Abstract】 Silicon-containing arylacetylene resin (PSA-R), offering high-temperature resistance, low dielectric constant and loss, and the processability for resin transfer molding, has been found a wide application in aerospace and electrical industries. The cure kinetics of PSA-R resin was analyzed using dynamic Differential Scanning Calorimetry(DSC), and it was found that the cure of PSA-R resin followed an 2 order reaction mechanism, the apparent activation energy was 110KJ mol-1. The chemorheological behavior of PSA-R resin was studied with parallel plate viscosity spectrometer. A rheological mode based on the dual-Arrhenius equation was estabilished and used to simulate the rheological behavior of PSA-R resin. The model prediction determined from the dual-Arrhenius equation was in good agreement with experimental data.更多还原