【作者】 陈垦； 周付根； 金挺；

【Author】 CHEN Ken,ZHOU Fu-gen,JIN Ting(Bei Hang University,Beijing 100086,China)

【机构】 北京航空航天大学；

【摘要】 针对高分辨率PCB图像缺陷检测的应用需求,对于PCB图像覆铜层提取进行了相关研究。在分析各部分布线层、覆铜层、焊盘、连接孔、钻孔等元素的基础上,针对各部分元素在图像上的特点,重点研究了布线层识别与去除布线层的方法,并利用焊盘位置选择性保留焊盘,通过边界检测、多边形拟合,最终得到PCB覆铜层及部分焊盘的拟合多边形信息,为覆铜层缺陷检测提供原始数据。实验结果表明,上述方法能够很精确提取PCB中的覆铜层。更多还原

【Abstract】 Regarding on the application of faults detection of high-resolution PCB images,auto image extraction method of the PCB copper layer is carried out.Base on the analysis of the various parts of PCB,including wiring layer,copper layer,pads,connecting holes,drilling holes and other elements,and their characteristics in the images,the study focus on identifying and extracting of wiring layer,selective retention of the location of pad,Finally the fitting polygon information of copper layer and part of the pad are obtained through the edge detection and polygonal fitting,which provide raw data defect detection.The experimental results show that the copper layer of PCB can be precisely extracted through presented method.更多还原