【作者】 刘兴胜； 王警卫； 张恩涛； 熊玲玲； 赵卫；

【Author】 LIU Xing-sheng 1,2,WANG Jing-wei1,ZHANG En-tao1,XIONG Ling-ling1,ZHAO Wei1(1 State Key Laboratory of Transient Optics & Photonics,Xi’an Institute of Optics & Precision Mechanics of Chinese Academy of Sciences,Xi’an 710119,China)(2 Xi’an Focuslight Optoelectronics Technology Co.,Ltd.,Xi’an 710119,China)

【机构】 中国科学院西安光学精密机械研究所瞬态光学与光子技术国家重点实验室； 西安炬光科技有限公司；

【摘要】 由高功率半导体激光器泵浦的固体激光器应用广泛,如工业、军事、医学和直接材料处理,如焊接、切割、表面处理等领域的应用。由于成本低、寿命长和新应用的快速增加,近年来对高功率半导体激光器和其相关的新产品不断提出了新的要求。因此高功率半导体激光器封装技术得到高速发展,同时也面临越来越大的挑战。文中综述了现有高功率半导体激光器(其中包括单发射腔、巴条、水平阵列和垂直叠阵)的封装技术,并讨论了其发展趋势。然而,封装技术仍然是高功率半导体激光器发展的一个瓶颈。文中还分析了半导体激光器封装技术存在的问题和面临的挑战,并提出了解决问题的方法和策略。更多还原

【Abstract】 High power semiconductor lasers have found increased applications in pumping of solid state laser systems for industrial,military and medical applications as well as direct material processing applications such as welding,cutting,and surface treatment.Driven by low cost,longer lifetime and new applications,the requirements of high power semiconductor lasers have been changed and the demand for new products has been accelerated in recent years.As a result,the packaging technologies of high power semiconductor lasers have been highly developed and have become more sophisticated.In this paper,we review and discuss the technology development trend of high power semiconductor lasers,including single emitters,bars,horizontal bar arrays and vertical bar stacks.However,the packaging technology is still one of the bottlenecks of the advancement of high power semiconductor lasers.The challenges and issues in high power laser packaging will be discussed and some approaches and strategies in addressing the challenges and issues will be presented.更多还原