【作者】 姜文全； 杜广煜； 巴德纯； 杨帆；

【Author】 JIANG Wen-quan 1,2,DU Guan-yu 1,Ba De-chun 1,YANG Fan 2(1 School of Mechanical Engineering and Automation,Northeastern University,Liaoning Shenyang 110819;2 School of Mechanical Engineering,Liaoning Shihua University,Liaoning Fushun 113001

【机构】 东北大学机械工程及自动化学院； 辽宁石油化工大学机械工程学院；

【摘要】 基体-薄膜结构是微电子器件中的典型结构,尤其是金属薄膜已被广泛的应用到微电子器件上。金属薄膜在制备过程中产生的表面微裂纹对薄膜的力学性能有着较大的影响,并且表面微裂纹尖端扩展所导致的薄膜破裂,更是造成薄膜失效的主要形式,因此对金属薄膜表面微裂纹萌生行为的研究具有重要的意义。本文基于分子动力学,对连续载荷作用下的带有缺陷的铜金属薄膜进行模拟分析。计算得到了系统在拉伸方向上的应力-应变关系曲线。模拟结果显示,金属铜薄膜的原子运动对整体力学行为有明显的影响。同时模拟过程中发现,在连续载荷作用下,大量位错在金属薄膜缺陷附近产生,从而促使薄膜表面萌生微裂纹。更多还原

【Abstract】 Matrix-film structure is a typical structure in microelectronic devices,metal films are widely appliedin microelectronic device especially Surface micro-cracks produced in the preparation process of metal films have influence on films mechanical propertie significantly,and the disruption caused by surface micro-crack tip extension is main forms on film failure,so research on initiation behavior of surface micro-crack for metal film has important significance.In this paper,Cu films with defects were simulated and analyzed by molecular dynamics under continuous loading.The stress-strain curve of the whole system in the drawing direction was obtained.Results showed that the atomic motion influnced the overall mechanical behavior obviously.And in simulation process,a lot dislocations produced in films near defect under continuous loading,thus made film surface micro-crack initiation.更多还原