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平板基片溅射镀膜的膜厚均匀性研究(英文)

Research on Film Thickness Uniformity of Sputtering Deposition on Planar Substrate

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【作者】 张以忱宋青竹

【Author】 ZHANG Yi-chen~1 SONG Qing-zhu~2 (1.Northeastern University,Shenyang 110004,China;2.Shen Yang Vacuum Technology Institute, Shenyang 110042,China)

【机构】 东北大学真空与流体工程研究所沈阳真空技术研究所

【摘要】 磁控溅射镀膜是现代工业中不可缺少的技术之一,广泛应用于电子,建筑,汽车等行业中,尤其适用于大面积镀膜。镀膜工艺中的薄膜厚度均匀性,沉积速率,靶材利甩率等方面的问题是实际生产中十分关注的。薄膜厚度均匀性是检验溅射沉积过程的最重要参数之一,因此相关问题的研究具有重要的理论和应用价值。本文在现有理论基础上,分析了溅射镀膜膜厚分布的基本理论,采用了快、慢两种运动粒子作为沉积粒子的模型,并将其应用在矩形平面磁控溅射靶上。应用Matlab软件,对一种矩形平面磁控溅射靶的沉积膜层厚度的均匀性进行了数值计算,得到如下结论:膜厚的均匀性随靶基距的增加而降低,随靶端部刻蚀面积的减小而降低,当靶端部刻蚀面积增大到一定程度后,膜厚的均匀性随靶基距的增加先升高后降低;膜厚的均匀性随靶刻蚀区长宽比的增加有两种变化趋势:当刻蚀区域的长度不变时,膜厚均匀性略有降低,当其宽度不变时,膜厚均匀性有显著升高。在一定范围内,膜厚均匀性分别随功率降低和气体温度的升高(或气压的降低)而降低。薄膜沉积速率分别随靶基距的降低,电源功率和气体温度的升高(或气压的降低)而增加。

【Abstract】 Magnetron sputtering coating is one of the indispensable technologies of modern industry,which is widely applied in electronics,construction,automobiles and other industries,especially the large area deposition,and more and more attention is paid to thin film thickness uniformity,deposition ratio,utilization ratio of target material and other problems in coating industry.As one of the most important parameters for testing sputtering process,the study on the related issues of thin film uniformity is of great theoretical and practical value.The fundamental theory on deposition of sputtering coating is analyzed based on existing theories,and the model of deposition flux that is composed of fast- and slow-moving particles is applied to the rectangular planar magnetron sputtering target.Through the application of Matlab software and the numerical calculation of thin film deposition uniformity of a rectangular planar magnetron sputtering target,it is easy to come to the following conclusions:the thickness uniformity will reduce with the increase of target-substrate distance and with the decrease of erosion zone of the target ends.When the erosion zone of the target ends increases to some extend,the thin film thickness uniformity will become higher with the increase of target-substrate distance and then become lower.There are two tendencies for thin film thickness uniformity with the increase of length-width ratio of target erosion zone,that is,it will become a little lower when the length is a constant,or become higher when the width is a constant.And the thin film thickness uniformity will become lower with the decrease of power and the increase of gas temperature.The deposition rate will become higher with the decrease of target-substrate distance,or the increase of power and gas temperature.

  • 【会议录名称】 真空技术与表面工程——第九届真空冶金与表面工程学术会议论文集
  • 【会议名称】第九届真空冶金与表面工程学术会议
  • 【会议时间】2009-08-24
  • 【会议地点】中国辽宁沈阳
  • 【分类号】TB383.2
  • 【主办单位】中国真空学会真空冶金专业委员会、沈阳市真空学会
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