【作者】 胡洋洋； 朱荻； 李寒松； 曲宁松； 明平美；

【Author】 Hu Yangyang,Zhu Di,Li Hansong,Qu Ningsong,Ming Pingmei

【机构】 南京航空航天大学/江苏省精密与微细制造技术重点实验室；

【摘要】 以微细阵列电极作为工具电极进行群孔微细电解加工可显著提高加工效率,其中阵列电极的制造是该工艺的关键技术。采用UV-LIGA技术制作超高金属微细阵列电极,并利用电解置桩的方法辅助去除SU-8胶。通过单次涂胶、提高前烘温度、降低后烘温度的方法制作了厚度达1 mm的SU-8胶结构;采取电解置桩法在金属基底上电解得到微坑,增强电铸金属电极与金属基底的结合力,保证去胶后电铸金属的完整性。最终获得了高800μm、线宽300μm的金属微细阵列电极结构,并通过微细电解加工出微细阵列群孔。更多还原

【Abstract】 Using electrode array instead of a single electrode can increase the efficiency of the micro-electrochemical machining(Micro-ECM),the fabrication of the electrode array is the key point.In this paper,UV-LIGA technology was investigated to fabricate the ultra-high micro electrode array,and the micro electrochemical machining was used as an aided method to remove the SU-8 resist.During the lithography process,SU-8 mold up to 1mm thick was fabricated on the substrate.Before the electroforming process,a reverse polarity procedure was carried out to make the micro roots on the substrate,which could enhance the adhesion of the micro copper electrode array electroformed to the substrate.The micro electrode arrays up to 800μm high with different shapes were fabricated.The result indicates that UV-LIGA is an excellent method for fabricating ultra-high metal micro electrode array.更多还原