节点文献
一种Mushroom型宽带多过孔EBG级联结构
A Novel Broadband EBG Using Multi-via cascaded Mushroom-like Structure
【Author】 Zhang Wei1 Liang Chang-Hong1 Ding Tong-Hao2 Tan Kang-Bo1 (National Key Laboratory of Antennas and Microwave Technology, Xidian Univ., Xi’an, Shaanxi 710071, China) 1 (Inst.of Electronic CAD, Xidian University, Xi’an, Shaanxi 710071, China) 2
【机构】 西安电子科技大学天线与微波技术国家重点实验室; 西安电子科技大学电路CAD研究所;
【摘要】 分析研究了多过孔Mushroom型电磁带隙结构(EBG)的带隙特性,理论分析了双过孔EBG结构与单过孔EBG结构之间的参数比例关系,利用直接传输方法计算出具有不同过孔数EBG结构的传输带隙,验证了理论分析结果的正确性。通过将单过孔EBG结构与双过孔EBG结构级联来展宽EBG结构的带宽。传输带隙图表明该级联结构几乎覆盖了单过孔与双过孔EBG结构各自的带宽,实现了展宽EBG结构带宽的目的。
【Abstract】 Transmission characteristics of mushroom-like EBG structure with multi via are investigated, theory analyses are presented to show the relations between the parameters of the two-via EBG structure and the one-via EBG structure. Direct transmission method is used to compute the transmission band-gap of the EBG structures with different number of vias, and the theory analyses are validated to be correct. The bandwidth of the EBG structure is broadened by cascading the one-via EBG with the two-via EBG. The transmission parameters show that the band-gap of the cascaded structure almost covers both the bands of the one-via EBG structure and the two-via structure, which realizes the purpose of broadening the bandwidth of the EBG structure.
- 【会议录名称】 2009年全国天线年会论文集(上)
- 【会议名称】2009年全国天线年会
- 【会议时间】2009-10-13
- 【会议地点】中国四川成都
- 【分类号】TM203
- 【主办单位】中国电子学会