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基于虚拟仪器的氢化纳米硅薄膜应变系数测量系统的设计

Design of Hydrogenated Nanocrystalline Silicon Film’s Gauge Factor Measurement System Based on Virtual Instrumentation Technology

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【作者】 潘海彬潘浩李伯全罗开玉王小飞

【Author】 Pan Haibin~(1,2) Pan Hao~1 Li Boquan~1 Luo Kaiyu~1 Wang Xiaofei~1 (1 Department of Measurement & Control Technology Jiangsu University Zhenjiang 212013 China; 2 Center of Micro-Nano Science and Technology Jiangsu University Zhenjiang 212013 China)

【机构】 江苏大学测控技术与仪器系江苏大学微纳米科学技术研究中心

【摘要】 氢化纳米硅薄膜是一种具有显著压阻效应的新型半导体薄膜材料。本文应用四点弯曲法并基于虚拟仪器技术设计了氢化纳米硅薄膜应变系数测量平台,该平台利用虚拟仪器技术将测量硬件Agilent 34410A和NI 9237与计算机结合,并通过编程实现纳米硅薄膜在应力作用下的相应电阻变化和应变的测量和数据处理,从而实现纳米硅薄膜应变系数的自动测量。实验结果表明,基于虚拟仪器的纳米硅薄膜应变系数测量系统解决了采用传统的方法无法进行薄膜材料应变系数测量的问题,缩短了薄膜应变系数测量系统的开发时间,提高了测试的自动化程度、测试精度和效率,更重要的是该测量系统的测量结果为纳米硅薄膜在力敏传感器中的应用提供了理论依据。

【Abstract】 Hydrogenated nanocrystalline silicon film is a new type of thin film semiconductor which presents significant piezoresistive effect.In this paper,a measurement system for thin film’s gauge factor has been designed based on four-point bending method and virtual instrumentation technology.Measurement hardware, Agilent 34410A and NI 9237 are controlled by virtual instrumentation software and work together for measurement of hydrogenated nanocrystalline silicon film’s small resistance change and small strain when hydrogenated nanocrystalline silicon film is under stress.At last hydrogenated nanocrystalline silicon film’s gauge factor is achieved by programming.The experimental results show that the hydrogenated nanocrystalline silicon film’s gauge factor measurement system has solved the problem of thin film materials’ gauge factor measurement, and the time of measurement system development has been shortened,and based on the system the level of automation,accuracy and efficiency for measurement has been improved,and more importantly,the results from the measurement system have provided the theoretical basis for hydrogenated nanocrystalline silicon film’s application in pressure sensor.

【基金】 国家自然科学青年基金(50805068)
  • 【会议录名称】 2009中国仪器仪表与测控技术大会论文集
  • 【会议名称】2009中国仪器仪表与测控技术大会
  • 【会议时间】2009-07-23
  • 【会议地点】中国黑龙江哈尔滨
  • 【分类号】TH823.3
  • 【主办单位】中国仪器仪表学会
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