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亚微米级道沟的超级化学镀镍填充工艺
Bottom-up Filling for Submicro-Trenches by Electroless nickel Plating
【Author】 SONG Yu;WANG Zeng-lin;Key Laboratory for Applied Surface & Colloid Chemistry of the Ministry of Education,School of Chemistry & Materials Science,Shanxi Normal University;
【机构】 应用表面与胶体化学教育部重点实验室,陕西西安陕西师范大学化学化工学院;
【摘要】 本文在次磷酸钠化学镀镍体系中研究共同添加3-巯基丙烷磺酸钠盐(MPS)和聚乙烯亚胺-5000(PEI-5000)对超级化学镀镍的影响,通过线性扫描伏安法研究了添加剂对阳极、阴极化曲线的影响。研究结果表明:随着3-巯基丙烷磺酸钠盐(MPS)浓度的增加,化学镀镍平均速率增大,当MPS浓度达到5mg/L时镀镍平均速率达到最大,然后在此溶液中继续添加PEI-5000,发现沉积速率会下降,且比单独添加PEI-5000还小。利用MPS对化学镀镍的加速作用和PEI-5000的抑制作用,以及其在溶液中低的扩散系数,成功实现了超级化学镍的完全协同填充。
【Abstract】 The effect of 3-mercapto propane sulphonate Sodium(MPS) and polyethylene imine-5000(PEI-5000) on bottom-up filling of electroless nickel was studied in sodium hypophosphite system,The effects of MPS and PEI-5000 on anodic and cathodic polarization curves of the electroless nickel plating bath was researched by linear sweep voltammetry method.The results indicated that the average deposition rate of electroless plating nickel was strengthened with an initial addition of MPS,and reached a maximum when MPS concentration was 5 mg L-1.However,when MPS concentration was 5 mg L-1 in the plating bath,the inhibition of PEI-5000 for electroless plating nickel average deposition became very significant。The result of liner sweep voltammetry measurement showed that MPS and PEI-5000 inhibited the electroless nickel.Bottom-up filling of trenches was achieved by addition of MPS and PEI-5000 in its concentration gradient from the top to the bottom.
【Key words】 bottom-up filling of electroless nickel; Additive; Linear sweep voltammetry;
- 【会议录名称】 第三届环渤海表面精饰发展论坛论文集
- 【会议名称】第三届环渤海表面精饰发展论坛
- 【会议时间】2014-08-07
- 【会议地点】中国山西太原
- 【分类号】TQ153.12
- 【主办单位】环渤海表面精饰联席会