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低磷化学镀镍补加工艺的研究

Study on the Additive System in Low-P Electroless Nickel Plating

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【作者】 郑振李宁黎德育

【Author】 Zheng Zhen,Li Ning,Li De-yu (Department of Applied Chemistry,Harbin Institute of Technology,Harbin,150001)

【机构】 哈尔滨工业大学应用化学系

【摘要】 低磷化学镀镍层具有较高的熔点和较好的脱模性,而且它的耐碱腐蚀能力很强,主要应用于电子元件的可焊性和高硬度处理方面。为了在工业生产中应用,对镀液的补加体系进行了研究。首先通过分析化学的方法,确定了补加液的组成。对周期实验初期出现的镀液分解的现象进行了分析,并提出了可行的解决方案。为了研究不同补加方式对镀液和镀层的影响,分别采用按时补加和在线补加两种方法,研究了不同补加方式对镀液的镀速、周期稳定系数、镀层磷含量、可焊性、硬度、表面微观形貌、孔隙率和耐蚀性的影响,发现在线补加方式除耐蚀性外,其它镀液镀层性能均高于按时补加或与按时补加持平。研究发现通过选择合适补加工艺,可以使镀液在经过4个MTO后,稳定性保持良好;镀速始终保持在15μm/h以上;镀层中磷含量低于4.5%;保证良好的镀层可焊性。

【Abstract】 The low phosphorus EN layer has higher melting point and good removing mold capability,its corrosion resistance is special good in alkali environment.The low - PEN layer can be used in electron welding area and high hardness treatment. For the industrial practicability,the solution additive system was studied.The additive solution composition was confirmed by the analytical chemistry method.And the phenomenon that the solution deposited early in the MTO test was analyzed,and then the feasible solution method was put forward.The effects of different additive methods on the solution and the layer were studied.There were two kinds of additive methods,punctual additive and on - line additive.The effects of these two additive methods on depositionrate,MTO stable coefficient,phosphorus content,solderability,the hardness before and after the heat treatment,surface microstructure,the porosity and the corrosion resistance were studied.The result showed the layer from online system was better than the layer from punctual system on any performance except the corrosion resistance.The studying showed that through choosing the right additive method,the EN solution stability was good;the deposition rate was more than 15μm/h;P content of the layer was less than 4.5%;the layer had good solderability.

【关键词】 化学镀镍低磷周期可焊性
【Key words】 electroless nickel platinglow- PMTOwelding capability
  • 【会议录名称】 2009年全国电子电镀及表面处理学术交流会论文集
  • 【会议名称】2009年全国电子电镀及表面处理学术交流会
  • 【会议时间】2009-11-01
  • 【会议地点】中国上海
  • 【分类号】TQ153.12
  • 【主办单位】中国电子学会生产技术学分会电镀专家委员会、上海市电子学会电子电镀专业委员会
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