【作者】 张金凤； 刘慧丛； 李卫平； 朱立群；

【Author】 Zhang Jinfeng,Liu Huicong,Li Weiping,Zhu Liqun (School of Materials Science and Engineering,Beijing University of Aeronautics and Astronautics,Beijing 100191,China)

【机构】 北京航空航天大学材料科学与工程学院；

【摘要】 针对塑封电子器件在运输和储存过程中存在的失效问题,研究了塑封电子器件分别浸泡在60℃和80℃的去离子水和5%(质量分数)NaCl溶液中试验对其质量、硬度、微观结构、形貌等性能的影响。结果表明,浸泡试验后塑封电子器件的质量增加,并且同温度下去离子水比5%NaCl溶液的质量增加更明显;相对硬度值呈先增后稳定趋势,试验温度和浸泡溶液对相对硬度值的影响很小;FTIR的分析表明,在浸泡试验过程中有化学键的消失;SEM的分析表明,塑封电子器件的塑封料内部存在一定的缺陷,为水分的吸收提供了一定的存贮空间,并为塑封电子器件贮存环境下性能的失效埋下了安全隐患。更多还原

【Abstract】 Electronic components in the storage environment are usually led to failure due to the effect of the ambient temperature and medium.Therefore,the failure behavior of the epoxy molding compound(EMC) used in electronic components was discussed by investigating the changes of their quality,hardness,mechanical properties,microstructure,morphology and composition when soaked in both deionized water and 5%(mass fraction NaCl) salt water at 60℃and 80℃.The results show that with the soaked time increasing,the quality of EMC increases while mechanic performance decreases.But the hardness is not so sensitive to the changes of the temperature and medium.Moreover,the results of the infrared spectrum analysis show that there are structure changes of the EMC during the aging.And the internal defects shown by the SEM may lead to the failure of the EMC in a long- time storage.更多还原