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氯化胆碱-尿素离子液体中Zn的电沉积行为及其在AZ91D镁合金上的电镀研究
Electrodeposition behavior of Zn and electrodeposition of Zn on AZ91D in choline chloride-2urea ionic liquids
【Author】 Haiyan Yang~(1,2),Xingwu Guo~(1,2),Guohua Wu~(1,2),Wenjiang,Ding~(1,2) (1.National Engineering Research Center of Light Alloy Net Forming,Shanghai Jiaotong University,Shanghai,200240,PR China 2.State key laboratory of metal matrix composites,Shanghai Jiaotong University,Shanghai,200240,PR China)
【机构】 上海交通大学轻合金精密成型国家工程研究中心; 上海交通大学金属基复合材料国家重点实验室;
【摘要】 镁合金由于化学活性高,在水溶液中电镀时存在很多困难。本文采用氯化胆碱-尿素离子液体作为溶剂,对Zn的电沉积行为和AZ91D镁合金上电镀Zn进行了研究,并对Zn镀层的耐腐蚀性能进行了电化学测试。结果表明,AZ91D镁合金在氯化胆碱-尿素中电镀可获得Zn镀层,浸Zn前处理能使Zn的沉积电位发生正移,无需形核过电位,且能提高镀层结合力;脉冲电镀比恒流电镀更利于获得致密均匀、与基体结合良好的Zn层;恒流电镀Zn层后,基体AZ91D镁合金的开路电位OCP从-1610mV正移至-1265mV,腐蚀电流icorr从14.9μA·cm-2降为10.2μA·cm-2,脉冲电镀Zn层后开路电位OCP进一步正移至-1140mV,腐蚀电流icorr降为6.5μA·cm-2,与纯Zn=6.6μA·cm-2相当。
【Abstract】 In aqueous electrolytes,electrodeposition on Mg alloys is still a challenge because Mg has high chemical and electrochemical activities.In present study,electrodeposition behavior of Zn and electrodeposition of Zn on AZ91D in ChCl-urea ionic liquids was investigated and the corrosion resisitance of the Zn layers were studied by electrochemical testing.The results show,Zn layers can be deposited on AZ91D by electrodeposition in ChCl-urea ionic liquids.By Zn immersion on AZ91D,the reduction potetial of Zn moves in positive direction without nucleation overpotential and the adhesion of Zn layers is improved.Application of pulse deposition was superior to galvanostatic deposition in producing dense,uniform and cohesive Zn layers.By galvanostatic deposion Zn layers,the OCP of AZ91D moves in positive direction from-1610mV to-1265mV and the corrosion current density icorr decreases from 14.9μ·cm-2 to 10.2μA·cm-2.By pulse deposion Zn layers the,OCP moves in positive direction further to-1140mV and the corrosion current density icorr decreases to 6.5μA·cm-2,comparable to pure Zn=6.6μA·cm-2.
【Key words】 AZ91D magnesium alloy; Ionic liquids; Electrodepositon; Corrosion;
- 【会议录名称】 2009年全国电子电镀及表面处理学术交流会论文集
- 【会议名称】2009年全国电子电镀及表面处理学术交流会
- 【会议时间】2009-11-01
- 【会议地点】中国上海
- 【分类号】TQ153.1
- 【主办单位】中国电子学会生产技术学分会电镀专家委员会、上海市电子学会电子电镀专业委员会