【作者】 杨防祖； 赵媛； 姚士冰； 田中群； 黄令； 周绍民；

【Author】 Fang-Zu Yang,Yuan Zhao,Shi-Bing Yao,Zhong-Qun Tian,Ling Huang,Shao-Min Zhou (State Key Laboratory of the Physical Chemistry of the Solid Surfaces,College of Chemistry and Chemical Engineering,Xiamen University,Xiamen 361005)

【机构】 固体表面物理化学国家重点实验室厦门大学化学化工学院；

【摘要】 本文以柠檬酸盐一酒石酸盐为主络合剂,结合辅助络合剂,研究锌基合金上碱性无氰镀铜工艺;探索了搅拌、镀液温度、pH值、铜离子浓度和添加剂对镀层质量的影响;测试了镀液的电流效率、深镀能力、分散能力、抗杂质能力、镀层与基体的结合力、镀层表面形貌和结构。实验结果表明,本工艺中,可以在宽广的实验范围内获得光亮的铜镀层;电流效率随电流密度、温度和pH值提高而增大;镀液有较强的抗杂质能力、深镀能力达100%、分散能力为84.1%、电流效率在90%左右;镀层晶粒细小、致密、平整、颗粒分布均匀,与基体结合牢固。更多还原

【Abstract】 In this paper,the process of non-cyanide copper electroplating on zinc-based substrate was developed using citrate-tartrate as complexing agent combined with a assistant complexing agent.The effects of agitation,bath temperature,pH, copper ions concentration and additive on deposits appearances were studied.The current efficiency,the bath covering power, throwing power,the ability of anti-impurities,the cohesive ability of copper to zinc-based alloy substrate,the deposit morphology and structure were also characterized.The results show that,in this bath the bright copper deposit can be plated under wide condition ranges.The current efficiency is increased by the increasing of current density,bath temperature and pH value.The bath is with good ability of anti-impurities,covering power is 100%,throwing power is 84.1%,current efficiency is about 90 %.Copper deposit is in smooth and neat appearance and good cohesive ability to the substrate.更多还原