节点文献
添加剂对DMH无氰镀银的影响
Influence of Additive on DMH Cyanide-free Silver Electroplating Process
【Author】 YANG Pei-xia,AN Mao-zhong,LIU Yan-fei (School of Chemical Engineering and Technology,Harbin Institute of Technology,Harbin 150001,China)
【机构】 哈尔滨工业大学化工学院;
【摘要】 本文研究了以5,5-二甲基乙内酰脲为配位剂的无氰镀银液的添加剂组成。通过单因素实验进行了单一添加剂的筛选,并选定有机醇、有机醛和乳化剂作为复合添加剂的组成。通过正交试验,确定了复合添加剂组成为有机醇0.2g/L,有机醛0.1g/L,乳化剂0.02g/L。采用扫描电镜观察镀层的微观形貌,结果表明,镀液中加入复合添加剂后,金属银的结晶变得更加细小。
【Abstract】 An Additive composition of cyanide - free silver plating with 5,5 - dimethylhydantoin as complex forming agent has been studied in this paper.Single additive is selected by controlling only one experimental condition and organic alcohol,organic aldehyde,emulsifier are selected as the following three factors of orthogonal test;Orthogonal test defined the composition of additives,which are organic alcohol 0.2g/L,organic aldehyde 0.1g/L,emulsifier 0.02g/L.The micromorphology of electrodeposits was observed by SEM,SEM images of electrodeposits showed crystals of metallic silver became smaller after the addition of compound additive into electrolyte.
【Key words】 cyanide-free silver plating; 5,5-dimethylhydantoin; additive;
- 【会议录名称】 2009年全国电子电镀及表面处理学术交流会论文集
- 【会议名称】2009年全国电子电镀及表面处理学术交流会
- 【会议时间】2009-11-01
- 【会议地点】中国上海
- 【分类号】TQ153.16
- 【主办单位】中国电子学会生产技术学分会电镀专家委员会、上海市电子学会电子电镀专业委员会