【作者】 蓝立文；

【Author】 Lan Liwen (Chemistry and Engineering Department,Northwestern Polytechnical University,Xi’an,710072)

【机构】 西北工业大学化工系；

【摘要】 评述了以聚酰亚胺(PI)、双马来酰亚胺(BMI)和氰酸酯为代表的耐高温有机胶粘剂的发展。PI是目前应用最广、耐温等级最高的有机胶粘剂,它是在PI化学和结构与性能关系的基础上解决了工艺性之后发展起来的。热塑性PI具有优良的韧性和粘接性能;热固性PI则具有较好的工艺性和更高的耐温性。与PI相比,BMI具有优良的工艺性,而且价廉,但耐温性比PI低。BMI的改性方法较多,在此基础上开发了许多BMI树脂。氰酸酯具有环氧树脂的工艺性,优异的介电性能和粘接性能,其中一些氰酸酯树脂可作为耐高温胶粘剂。更多还原

【Abstract】 This thesis takes Polyimide(PI), Bismaleimide(BMI) and Cyanates as representatives to summarize the development of high temperature resistant organic adhesives.Presently,PI is an organic adhesive which is used most widely and is resistant to temperature reaches the highest degree.It is developed after the problem of technology has been solved based on PI chemistry and the relation between structure and property.Thermoplastic PI has excellent toughness and adhesiveness. Thermoset PI has better technology and higher resistance to temperature.Compared with PI,BMI has outstanding technology and low cost, but resistance to temperature is lower than that of PI.There are many ways to modify BMI,based on these methods,many kind of BMI resin are developed. Cyanates has the same technology as epoxy resin,excellent dielectric property and adhesiveness. Some cyanates resin may be used as high temperature resistance adhesive.更多还原