【作者】 罗峥； 林晨光； 魏衍广；

【Author】 LUO Zheng,LIN Chen-guang,WEI Yan-guang (Beijing General Research Institute for Nonferrous Metals,Powder Metallurgy & Special Materials Research Department,Beijing 100088,China)

【机构】 北京有色金属研究总院粉末冶金及特种材料研究所；

【摘要】 采用平均粒度为13μm的水雾化铜粉和石蜡基粘结剂,重点对铜散热片的密度,碳、氧含量及热导率进行分析和研究。结果表明,铜散热片烧结过程中在900℃保温一段时间,烧结温度为1050℃。烧结后铜散热片的密度由下端底座至上端鳍片,逐渐增加。铜散热片的热导率随着密度的增加而增加,最大值超过320W/(m·K)。更多还原

【Abstract】 The technology of injection molding was studied using water atomized copper powders with the mean particle size 13μm and a kind of wax-based polymer.Densities,carbon and oxygen content and thermal conductivity of copper heat sink were systematically analyzed and investigated.The results showed that the process of sintering of copper heat sink was 900℃holding for a long time,sintering at 1050℃.Sintering densities of copper heat sink increased from the bottom up.As densities of copper heat sink increased,thermal conductivity was improved gradually,the most value was beyond 320 W/(m·K).更多还原