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摩擦表面纳米铜自修复膜显微硬度分析
The micro-hardness analysis of self-repairing film formed by nano-Cu
【Author】 LIU Qian;XU Yi;WANG Xiaoli;SHI Pei-jing;YU He-long;Department of Remanufacturing engineering,Academy of Armored Forces Engineering;
【机构】 装甲兵工程学院装备再制造工程系;
【摘要】 利用T-11摩擦磨损试验机和MM-200摩擦磨损试验机进行了用纳米铜添加剂润滑的摩擦磨损试验,在磨痕表面形成了富含Cu元素的表面膜。纳米压痕试验结果表明,基体的硬度为10~12GPa,而表面自修复膜的硬度从5GPa到10GPa,变化范围比较大。从硬度以及加工硬化程度和蠕变位移的测试结果可以看出,摩擦表面自修复膜的这些性能与纯铜膜的性能有很大的区别,而且在不同的深度有不同的变化,说明薄膜不是均匀铜膜,而是在成分、组织结构上有变化的复合膜。
【Abstract】 The wear test was carried out on a T-11 ball-on-plate friction and wear tester and MM-200 friction and wear tester.A film mainly made of Cu was formed on the worn surface.Nano-indentation tests indicated that the copper film formed by Cu nano-particles additives has a lower hardness compared with that of the base material.The hardness of base materials varied from 10 GPa to 12 GPa,while the hardness of the self-repairing film was varied from 5GPa to 10 GPa.Results showed that the hardness,work hardening and creep displacement values of the self-repairing film were markedly different from that of the pure Cu film and varied with depth.This tells that the self-repairing film is a composite film of varying composition and structure rather than a homogeneous Cu film.
【Key words】 nano-Cu; self-repairing film; nanoindentation; micro-hardness;
- 【会议录名称】 第八届全国表面工程学术会议暨第三届青年表面工程学术论坛论文集(四)
- 【会议名称】第八届全国表面工程学术会议暨第三届青年表面工程学术论坛
- 【会议时间】2010-04-25
- 【会议地点】中国北京
- 【分类号】TG115.5
- 【主办单位】中国机械工程学会表面工程分会