【作者】 肖松涛； 叶国安； 潘永军； 罗方祥； 杨贺； 兰天；

【Author】 XIAO Song-tao,YE Guo-an,YNAG He,LIU Xie-chun,LOU Fang-xiang, China Institute of Atomic Energy,P.O.Box 275-26,Beijing,102413,China

【机构】 中国原子能科学研究院；

【摘要】 为了解氨基羟基脲(HSC)在Purex流程铀钚分离中的作用,研究了氨基羟基脲的硝酸水溶液对30%TBP/煤油中Pu(Ⅳ)的还原反萃取行为,考察了氨基羟基脲的浓度、两相接触时间、两相相比、反萃液硝酸浓度、NO3-浓度、有机相U浓度和温度对Pu(Ⅳ)的还原反萃的影响。结果表明:延长两相接触时间能显著提高Pu(Ⅳ)的反萃率,增加氨基羟基脲的浓度、降低反萃液硝酸浓度、降低NO3-浓度、增加有机相铀浓度和升高温度也对Pu(Ⅳ)的反萃率有一定的提高。在相比(o/a)为1:1时,接触时间5s时,钚的反萃取率接近93%;相比(o/a)为4:1时,5s内钚的反萃取率可达57%以上。采用16级逆流反萃取实验(还原反萃段10级,补充萃取段6级),模拟PUREX流程1B槽U/Pu分离工艺,在相比(1BF:1BX:1BS)为6:1:1的条件下,U的收率大于99,99%,Pu的收率大于99.99%;铀中去钚的分离因数SFPu/U=2.5×104;钚中去铀的分离因数SFU/Pu=3.2×105。HSC作为还原反萃取剂,可以有效实现铀钚分离。更多还原

【Abstract】 In order to understand hydroxysemicarbazide’s role in the separation of Pu from u in Purex Process,the reduction stripping behavior of Pu(Ⅳ) from 30%TBP/OK with HSC was investigated under conditions of different temperature,different concentration of HSC,concentration of HNO3,concentration of N03-,concentration of U in organic phase,various contacting-time,phase ratios respectively.The results shown that the longer phase contacting-time,the higher reduction concentration,the higher U concentration in organic phase,the higher temperature,the lower HN03 concentration,the N03- concentration,the higher stripping rate of Pu is acquired.The batch stripping percentage of Pu(Ⅳ) approach 93%in contacting-time of 5 seconds at phase ratio(o/a) 1:1,compared with 57%in contacting-time of 5 seconds at phase ratio(o/a) 4:1.The application of HSC to separate Pu from U in the 1B contactor was studied by the 16 stages counter current experiment(in which 6 stages for supplemental extraction, 10 stages for stripping).It is shown that the recovery percentage of U reaches over 99.99%and the recovery percentage of Pu over 99.99%at phase ratio(1BF:1BX:1BS)=6:1:1.the separation factor of Pu from U(SFPu/U) is 2.5×104,the separation factor of U from Pu(SFU/Pu) is 3.2×105.The results shown that HSC as an new orgnic reductant can effectively achieve on the separation of Pu form U.更多还原