【作者】 孙凤莲； 赵智力； 王丽凤； 刘洋；

【Author】 SUN Fenglian,ZHAO Zhili,WANG Lifeng,LIU Yang Department of Material Science and Engineering,Harbin University of Science and Technology,Harbin, 150040,China

【机构】 哈尔滨理工大学材料学院；

【摘要】 电子封装焊点的界面化合物(IMC)的存在形态是影响连接强度的主要因素。本文借助化学深腐蚀和扫描电镜技术,对两种低银无铅凸点材料与Ni(凸点下金属)层形成的焊点界面IMC的三维立体形貌及在不同时效条件下的演变行为进行了对比分析。结果表明:Cu含量和高温时效对IMC的形貌和结构有重要影响;高温时效后在IMC晶粒上,有少量的类似气孔的空洞存在。选择适当的深腐蚀技术对分析界面化合物的三维立体形貌具有重要的作用。更多还原

【Abstract】 The reliability of electronic assembly solder interconnection is highly dependent on the properties of intermetalic compound(IMC) between interlayers.In this paper,three dimension morphologies of the IMCs between low-Ag solders and nickel Under-Bump Metallization(UBM) were obtained using SEM method combined with Deep-Etching technology.The evolutions of these IMCs after aging were investigated.Results shows that for the solder with lower copper addition,Ni3Sn4 was first found on the Solder/Nickel interface as needle-like and flake-like after reflow.While after 280 h aging at 200℃,flake-like IMC changed into irregular polyhedrons-like.For the solder with higher copper addition, irregular polyhedrons Ni3Sn4 IMC was found first on the Solder/Nickel interface after reflow.While after 280 h aging at 200℃,some more irregular polyhedrons(Cu,Ni)6Sn5 were found on the layer of Ni3Sn4. Voids were found in these newly formed IMC.The deeply etching technical is significant for understanding the morphology of IMC.更多还原