节点文献
前处理工艺对SiCp/Al复合材料表面化学镀镍的影响
Pretreatment technique of electroless nickel on the surface of SiCp/Al composite
【Author】 LI Li-bo1,AN Mao-zhong1,YANG Mei1,WU Gao-hui2 (1.Department of Applied Chemistry,Harbin Institute of Technology,Harbin 150001; 2.School of Material Science and Engineering,Harbin Institute of Technology,Harbin 150001)
【机构】 哈尔滨工业大学应用化学系; 哈尔滨工业大学材料科学与工程学院;
【摘要】 高体积分数的sic增强铝基复合材料(SiCp/Al)以其优良的热物理和机械性能在微电子、光学等领域得到了广泛的应用。为了使其具有良好的焊接性能和抛光性能,需要在表面镀覆一层金属保护层。化学镀是材料表面改性技术的重要方法之一。对于非金属材料化学镀而言,前处理是影响镀层的质量、与基体的结合强度以及沉积速度的关键步骤。本文探索了在Sicp/Al表面化学镀镍的前处理工艺及条件,系统分析并阐述了除油、粗化、活化等工序对化学镀镍磷合金的作用和影响,同时在最优的条件下成功地制备出光亮、均匀、完整且与基体结合良好的镍磷合金镀层。利用扫描电子显微镜(SEM)、能谱(EDAX)对镀层微观结构和成分进行表征。结果表明,前处理可以改变基体表面的结构形貌,影响镍磷合金镀层在其表面的分布,从而对镀层的质量起决定性作用。
【Abstract】 Silicon carbide/aluminum composite(SiCp/Al) with a big volume fraction,which is provided with excellent thermophysical properties and improved mechanical properties,has been applied widely to microelectronics and optic field.Metal layer as protector on the surface of such composite is coated by electroless Ni-P alloy in order to improve its welding and polishing properties.As far as electroless plating on nonmetal is concern,pretreatment is critical approach for quality of coating layer,adhesion between the plated nickel and the substrate as well as plating rate.In the present work,presentment process and conditions of electroless nickel plating on SiCp/Al have been investigated,as well as the effect of cleaning,etching and activation upon chemical Nickel-phosphate plating.At the same time,the nickel coating obtained with the optimization of pretreatment conditions is bright,even,integrity and good adhesion to the substrate.Morphology of the electroless nickel plating coating was observed by SEM and EDAX.The results indicate that pretreatment can mortify the structure of the substrate surface and influence the distribution of coating.Consequently, the process of pretreatment is key link to the coating layer.
【Key words】 pretreatment; electroless nickel; deposition rate; adhesion;
- 【会议录名称】 2004年全国电子电镀学术研讨会论文集
- 【会议名称】2004年全国电子电镀学术研讨会
- 【会议时间】2004-12-05
- 【会议地点】中国重庆
- 【分类号】TQ153.12
- 【主办单位】中国电子学会生产技术学分会、重庆表面工程技术学会