【作者】 贺岩峰； 孙江燕； 赵会然； 张丹；

【Author】 He Yanfeng,Sun Jiangyan,Zhao Huiran,Zhang Dan (Shanghai Sinyang Electronics Chemicals Co.,Ltd.,Shanghai 201803,China)

【机构】 上海新阳电子化学有限公司；

【摘要】 开发出了新型的甲基磺酸无铅纯锡电镀添加剂。该添加剂具有结晶细致、可焊性好、使用维护容易、消耗量低等优点。在对锡须进行充分研究的基础上,通过对电镀添加剂中各组分的作用和影响的详细研究,建立了锡须的抑制方法。研究了电镀工艺中的各种影响因素,确定了适宜的工艺条件。更多还原

【Abstract】 A novel additive for lead-free pure tin electroplating process in a methanesulfonic acid bath has been developed.The additive has some good features like thin crystalline grain,good solderability,easy to maintain,low consumption.Under the basis of extensively studied for tin whisker,the effect of compositions in the additive has been studied in detail and the mitigation strategies for tin whisker has been found.The effect of various factors in the electroplating process has been studied and the process parameters have been established.更多还原