【作者】 方克洪；

【Author】 Fang Kehong Guangdong shengyi sci.tech Co.,Ltd,Dongguan city 523039

【机构】 广东生益科技股份有限公司；

【摘要】 本文介绍了最近开发成功的一种高Tg(170℃)环氧玻纤布覆铜板,探讨了树脂的设计开发思路、层压板的制造工艺及其性能,并与国外同类产品进行了对比,结果表明,它具有较好的加工工艺性及电气机械性能,可满足高多层板及高温工作环境的要求。更多还原

【Abstract】 A last developed high Tg(170°C) glass-cloth base epoxy copper clad laminate has been introduced in this paper.the design route of resin system and the production process of laminate were studied. The properties of the laminate were compared with those of similar products abroad.The result show that the laminate has a good process ability and the product has excellent mechanical and dielectric properties and can be used in multilayer printed circuit board which the thermal-resistance reliability was required.更多还原