【作者】 余彬海； 李军政；

【Author】 Yu Binhai,Li Junzheng (Foshan Nationstar Optoelectronic Co.,Ltd.,Foshan 528000,China)

【机构】 佛山市国星光电股份有限公司；

【摘要】 介绍了大功率LED新型封装技术与传统封装技术的区别,并分析现有封装技术的不足。创新之处在于提出平面阵列式大功率LED新型封装技术,一种特别采用无胶道一次成型封装胶体注塑技术,既保证产品一致性,又降低生产成本,全工序可实现全自动化生产,具备较高的生产效率。详细描述了一种具备高导热系数的金属线路板,以及基于此材料的材料选择、结构设计、工艺流程设计和封装完成品的结构特点。论述了该结构的散热特性、生产效率优越性、色度特性分布的集中程度等方面的优势。更多还原

【Abstract】 The differences of the new high power LED packing technology and the traditional technology were introduced,and the defect of the traditional packing technology was analyses.The innovative aspects are the presentation of the plane array packing adopt without channel on once shaping.The technology can ensure the consistency,the lower cost and the high efficiency among products.There are some detailed description of MPCB with high thermal conductivity,the material choice,the structural design,the process design and the structural characteristics of finished products.Finally,the high thermal conductivity,the high production efficiency and the color distribution of this structure was discussed.更多还原