【作者】 杨海霞； 徐红岩； 刘金刚； 范琳； 杨士勇；

【Author】 Yang Haixia,Xu Hongyan,Liu Jingang,Fan Lin,Yang Shiyong (Laboratory of Advanced Polymer Materials,Institute of Chemistry, Chinese Academy of Sciences,Beijing 100080,China)

【机构】 中国科学院化学研究所高技术材料实验室；

【摘要】 随着电子产品高速化、高性能化、小型化、低成本化以及先进封装技术的不断出现和高密度封装基板的发展需求,对封装基板材料提出了更高的性能要求,包括高玻璃化转变温度、高热分解温度、低的热膨胀系数、高电绝缘性等性能。综述了高性能封装基板的发展进展以及柔性封装基板和刚性封装基板用高性能聚酰亚胺材料的研究进展。更多还原

【Abstract】 The rapid development of high-speed,high-performance,miniaturization and low cost of electronic products,advanced packaging technology and requirement of high density packaging substrate have already bring up the new challenge to packaging materials,including the properties of high glass transition temperature and high heat decompose temperatures,low thermal expansion coefficient,high electric insulation etc.The research development of high-performance packaging substrate and polyimide materials for advanced packaging substrate of flexible packaging substrate and rigid packaging substrate were reviewed.更多还原