【作者】 褚克； 贾成厂； 尹法章； 曲选辉；

【Author】 Chu Ke,Jia Chengchang,Yin Fazhang,Mei Xuezhen,Qu Xuanhui (School of Materials Science and Engineering in University of Science and Technology Beijing,Beijing 100083)

【机构】 北京科技大学材料科学与工程学院；

【摘要】 本实验首先用注射成型方法制备出SiC预成型坯,然后使用压力浸渗方法将熔融铝浸渗于预成型坯体,经过表面处理后得到体积分数为65%SiC颗粒的SiC_P/Al复合材料的封装盒体。经测试分析发现:使用注射成型和压力浸渗2步工艺制备的封装盒体中的铝,浸渗完全,内部组织均匀;材料的相对密度大于99%,在室温下的热膨胀系数为8.1×10^-6/ K,热导率接近130 W/（m·℃）,能够很好地满足电子封装的要求。更多还原

【Abstract】 SiC performed compact has been firstly manufactured by Powder Injection Molding （PIM）,and then electronic package box of SiCp（65%）/Al composite was manufactured by pressure infiltration,which force melt aluminum enter into the SiC_P performed compact.SiC_P（65%）/Al composites manufactured by PIM and Pressure Infiltration has high density and homogeneous microstructure. The relative density of composites is bigger than 99%.The thermal expand coefficient and thermal conductivity of composites are 8.1×10^-6/K and nearly 130 W/m-K at room temperature respectively,which are up to the request of the electronic package.更多还原