【作者】 陈磊；

【导师】 胡文成；

【作者基本信息】 电子科技大学 ， 化学工程与技术， 2025， 硕士

【摘要】 随着电子信息行业的迅猛发展,对于电子设备的集成度要求也在不断提高,特别是应用于航空航天和军事领域的电子装备。因此,将更多的元器件封装在有限面积的印制电路板上变得至关重要,以电阻器为代表的无源器件被直接埋嵌到多层板中为最佳解决方案。高磷Ni-P合金电阻薄膜制备工艺简单、电阻值稳定性好、耐腐蚀性能好,被广泛使用于印制电子电路中。化学镀法是一个成本低廉、工艺简单、操作简单的制备Ni-P合金电阻薄膜的方法。本研究通过化学镀工艺制备高磷Ni-P合金电阻薄膜,并通过优化镀前处理方式、镀液组分、工艺参数等来制备出均匀性佳的高磷Ni-P合金电阻薄膜。具体研究内容如下:（1）通过优化镀前处理方式探索出最佳的酸洗时间及恒电流极化的电流和时间,通过测试方阻值及均匀性确定了酸洗时间9 min,恒电流极化-384 m A,0.6 s为最佳;使用单因素法研究了不同镀液组分对于方阻值、均匀性、磷含量的影响,确定了镀液各组分的大致浓度范围;最后通过正交试验探究出高磷Ni-P合金电阻薄膜方阻均匀性及磷含量最佳的镀液组成,即Ni SO₄·6H₂O 30 g/L,Na₂H₂PO₂·H₂O30 g/L,丁二酸12 g/L,苹果酸6 g/L,乳酸12 g/L,SDS 0.1 g/L、乙酸铅1 mg/L。得到了方阻值为57.3Ω/□,均匀性为95.56%的Ni-P合金电阻薄膜。（2）进行制备18 inch×24 inch的Ni-P合金电阻薄膜时,均匀性骤降,通过优化工艺参数和改变镀液流动方式来进行均匀性的优化,工艺参数p H为4.0,温度为90℃,沉积时间为230 s,镀件移动速率为8 m/min,镀液循环速率为60 L/min条件下镀层方阻值在46.3-58.7Ω/□之间,平均方阻值为52.3Ω/□,均匀性高达85.62%。为了确定制备出的样品性能优劣,将自制样品与国外产品进行各项性能对比,发现国外产品与自制样品均表面成团簇瘤球状结构,且在综合对比粗糙度参数（Ra、Rz、Rt、Rv、Rq）时发现自制样品较优;其磷含量分别为12.66%、12.48%,自制样品略高;其Ni-P合金镀层结构均呈非晶态结构;国外产品的平均方阻值为56.4Ω/□,均匀性为82.79%,可知自制样品的均匀性优于国外产品。综合对比之下,自制样品的各项性能均相近或者优于国外产品。更多还原

【Abstract】 With the rapid development of the electronic information industry,the integration requirements for electronic devices are also increasing,especially for electronic equipment used in aerospace and military applications.Therefore,more components packaged in a limited area of the printed circuit board has become critical to resistors as the representative of the passive components directly embedded in the multilayer board as the best solution.High-phosphorus Ni-P alloy resistor films are widely used in circuits because of their simple preparation process,good resistance value stability,and good corrosion resistance.Chemical plating is a cost-effective,simple process and easy to operate method for preparing Ni-P alloy resistive films.In this study,high-phosphorus Ni-P alloy resistive films were prepared by chemical plating process,and the pre-plating treatment,plating solution components,and process parameters were optimized to prepare high-phosphorus Ni-P alloy resistive films with good uniformity.The specific research contents are as follows:（1）The optimal pickling time and constant current polarization current and time were explored by optimizing the pre-treatment of plating,and the optimal pickling time of 9 min and constant current polarization of-384 m A for 0.6 s were determined by testing the square resistance value and uniformity;the effects of different plating solution components on the square resistance value,uniformity,and phosphorus content were investigated by using the one-way method to determine the approximate concentration ranges of each component of the plating solution;and the optimal composition of the plating solution for the square resistance uniformity and phosphorus content of high-phosphorus Ni-P alloy thin films was investigated through orthogonal Finally,the orthogonal test was conducted to investigate the optimal composition of the plating solution for the uniformity of square resistance and phosphorus content of high-phosphorus Ni-P alloy resistive films:Ni SO₄·6H₂O（30 g/L）,Na H₂PO₂·H₂O（30g/L）,succinic acid（12 g/L）,malic acid（6 g/L）,lactic acid（12 g/L）,SDS（0.1 g/L）,and lead acetate（1 mg/L）.This formulation yielded a Ni-P alloy resistive film with a sheet resistance of 57.3Ω/□and outstanding uniformity of 95.56%.（2）The uniformity of Ni-P alloy resistor film with the size of 18 inch×24 inch decreased abruptly.By optimizing the process parameters and changing the flow mode of the plating solution to optimize the uniformity,it was found that the square resistance value of the plated layer was 46.3-58.7Ω/□with the p H of 4.0,the temperature of 90℃,the deposition time of 230 s,the plating movement rate of 8 m/min,and the circulating rate of the plating solution of 60 L/min.46.3-58.7Ω/□,and the average square resistance value was 52.3Ω/□,with a uniformity of 85.62%.In order to determine the performance advantages and disadvantages of the prepared samples,they were compared with the foreign samples,and it was found that the foreign samples and the best-prepared samples had the cluster tumor spherical structure on the surface and the best-prepared samples were better under the comprehensive comparison of the parameters of roughness;their phosphorus contents were 12.66%and 12.48%,and the best samples were slightly higher;their Ni-P alloy plating structures were amorphous;the average square resistance value of the foreign sample was 56.3-58.7Ω/□,and the uniformity was as high as 85.62%.The average square resistance value of the foreign samples is 56.4Ω/□,and the homogeneity is 82.79%,which is similar to the best-prepared samples derived from this study.更多还原