【作者】 王莹；

【导师】 马宁； 马力；

【作者基本信息】 哈尔滨工程大学 ， 材料与化工（专业学位）， 2024， 硕士

【摘要】 胶黏剂在现代工业很多领域都有很高的使用需求。近年来,基于界面粘合机制,如氢键、离子键、阳离子-π相互作用、疏水力相互作用等,目前已研发出多种新型仿生胶黏剂,这些胶黏剂的粘附强度已从几十千帕增加到数百千帕甚至兆帕级别。同时,用于制备胶黏剂的材料范围已经从环氧树脂扩展到超分子组装体、弹性体、水凝胶和其他材料。此外,胶黏剂的功能也从传统的粘合水中物体的功能扩展到多种功能,包括刺激响应性(温度、光、盐浓度、压力等)。胶黏剂系统多种功能的实现,拓宽了新型胶黏剂的应用前景。本论文将基于具有稳定性、低熔点的深共晶溶剂(Deep Eutectic Solvents,DES),设计并制备了两种具有不同功能的胶黏剂,并对其应用进行了探索。主要研究内容如下:(1)利用N-(2-羟乙基)丙烯酰胺(HEAA)和(3-氨丙基)三甲氧基硅烷(APTMS)制备一种新型的DES。通过调控不同反应温度、氢键供体和氢键受体不同质量比和不同反应时间下等影响因素,探索形成DES的条件。以HEAA/APTMS型DES为基础引入硅钨酸(Si W),聚合制备不同Si W含量和不同反应温度的DES导电胶黏剂。探讨Si W含量和反应条件对导电胶黏剂粘附强度、导电性、传热性能的影响,选出性能最佳的DES导电胶黏剂。Si W在基体中起到提供导电性和交联的作用,所以在研究过程中也会重点探索其导电和交联作用的协同作用对材料性能的影响。(2)以HEAA/APTMS型DES为基础引入2-苯氧乙基丙烯酸酯(PEA),聚合制备一种水下应用的胶黏剂。调控DES与PEA质量比、反应时间、APTMS水解和聚合间隔时间和交联剂含量等影响因素制备不同的水下胶黏剂。通过对不同水下胶黏剂进行粘附强度测试、流变测试和接触角测试,综合分析得到水下胶黏剂的最佳配方和反应条件。然后,从基体强度和表面化学结构两个维度分析粘附机理。最后,在不同液体环境、不同基材上进行粘附实验,尝试其在水环境下的具体应用。更多还原

【Abstract】 Adhesives are in high demand in many areas of modern industry.In recent years,based on the interface bonding mechanism,such as hydrogen bond,ionic bond,cation-π interaction,hydrophobic interaction,etc.,a variety of new bionic adhesives have been developed,and the adhesion strength of these adhesives has increased from tens of kpa to hundreds of kpa or even mpa level.At the same time,the range of materials used to prepare adhesives has expanded from epoxy resins to supramolecular assemblies,elastomers,hydrogels,and other materials.In addition,the function of adhesives has also expanded from the traditional function of bonding objects in water to a variety of functions,including stimulus-response(temperature,light,salt concentration,pressure,etc.).The realization of multiple functions of the adhesive system broadens the application prospect of the new adhesive.In this paper,two kinds of adhesives with different functions were designed and prepared based on the stable and low melting point Deep Eutectic Solvents(DES),and their applications were explored.The main research contents are as follows:(1)A novel DES was prepared from N-(2-hydroxyethyl)acrylamide(HEAA)and(3-aminopropyl)trimethoxy-silane(APTMS).The conditions for the formation of DES were explored by regulating factors such as different reaction temperature,different mass ratios of hydrogen bond donor and hydrogen bond acceptor,and different reaction time.Based on HEAA/APTMS type DES,silicotungstic acid(Si W)was introduced to prepare DES conductive adhesives with different Si W content and reaction temperature.The effects of Si W content and reaction conditions on the adhesion strength,electrical conductivity,and heat transfer of the conductive adhesives were investigated,and the best DES conductive adhesives were selected.Si W plays a role in providing electrical conductivity and crosslinking in the matrix,so the synergistic effect of its conductive and crosslinking effects on material properties will also be explored in the research process.(2)Based on HEAA/APTMS type DES,2-phenoxyethyl acrylate(PEA)was introduced and polymerized to prepare an adhesive for underwater application.Different underwater adhesives were prepared by adjusting the mass ratio of DES to PEA,reaction time,APTMS hydrolysis and polymerization interval,and the content of crosslinkers.The optimum formulations and reaction conditions of different underwater adhesives were obtained through the test of adhesion strength,rheology,and contact Angle.Then,the adhesion mechanism was analyzed from two dimensions matrix strength and surface chemical structure.Finally,the adhesion experiments were carried out on different liquid environments and different substrates to try its specific application in water environment.更多还原