【作者】 吴旭；

【导师】 王科平；

【作者基本信息】 天津大学 ， 电子科学与技术， 2022， 硕士

【摘要】 近年来,介质集成悬置线(Substrate Integrated Suspended Line,SISL)因其低损耗、低成本、自封装等特性在各种微波电路中得到了广泛的应用。为实现SISL与其他类型传输线的互连,并为各种SISL电路提供测试平台,基于SISL的过渡电路设计非常重要。随着集成电路技术向着更高速和更大规模迅速发展,芯片、电路间的高速互连技术成为了一个广受关注的课题,SISL低损耗、低色散的特点,使得其有望成为一种低成本高速互连平台。本文开展的主要工作如下:1、设计了一种SISL到悬置共面波导(Suspended Coplanar Waveguide,SCPW)的超宽带过渡电路。该设计基于多层印制电路板(Printed Circuit Board,PCB)工艺,使用低成本FR4介质。因为电路的各个部分均设计为悬置形式,过渡结构的带宽与之前相比大大提升了三倍。通过使用双层布线和介质切除,过渡电路的损耗进一步减小。实测结果表明,背靠背的过渡结构在dc到60 GHz频带范围内,回波损耗优于11.4 d B,插入损耗小于2.4 d B。2、设计了两种SISL的表贴式过渡电路。分别通过通孔和半壁孔耦合的方式,将SISL的信号从中间层过渡到顶层或者底层电路上。实测结果表明,该设计可以将26.5 GHz以下的SISL电路表贴到其他类型测试板上。3、研究了SISL的高速互连性能。对SISL的阻抗特性和损耗特性进行了分析,对SISL的衰减、色散、反射和振铃等信号完整性问题进行了仿真,仿真得到SISL在200 Gbit/s下的数据传输速率下,眼图性能良好,展现了SISL作为低成本高速互连解决方案的优势。更多还原

【Abstract】 In recent years,Substrate Integrated Suspended Line(SISL)has been widely used in various microwave circuits due to its advantages,such as low loss,low cost,and selfencapsulation.To implement the interconnection between SISL and other transmission lines,and to provide a test platform for various SISL circuits,the transition structure design of SISL is very important.With the rapid development of integrated circuit technology to higher speed and larger scale,high-speed interconnect technology between chips and circuits has become a widespread concern.The low-loss and lowdispersion characteristics of SISL makes it easier to be a high-speed interconnect platform with low cost.This paper is based on SISL platform,and the main work carried out is as follows:First,a transition from SISL to suspended coplanar waveguide is designed in this paper.The design is based on standard multi-layer Printed Circuit Board(PCB)process,and the substrates used are all low-cost FR4.Since each part of the circuit is designed in the suspended type,the bandwidth of the transition is greatly improved by three times compared with the state of art.By using SISL with double-metal layer and patterned substrate,the loss of the transition is further reduced.The results show that the proposed back-to-back transition has a return loss of better than 11.4 d B and an insertion loss of less than 2.7 d B from dc to 60 GHz.Second,two surface mount SISL transitions are designed.The signal of SISL is transferred from the middle layer to the top or bottom layer using via hole and half-wall hole coupling,respectively.The test results show that the design can surface mount SISL circuit below 26.5 GHz to the testboards with other types.Last but not least,the high-speed interconnect performance of SISL is studied.The impedance and loss characteristics of SISL are analyzed,and the signal integrity problems of SISL such as attenuation,dispersion,reflection,and ringing are simulated.The simulation result shows that the eye diagram of SISL platform performed well under 200 Gbit/s,illustrate the advantages of using SISL as low-cost high-speed interconnect solution.更多还原