【作者】 赵毅；

【导师】 刘淑梅；

【作者基本信息】 上海工程技术大学 ， 材料加工工程， 2021， 硕士

【摘要】 连接器是电气设备中的基础元件,在航天、军事以及汽车等领域有广泛应用,其连接可靠性与系统的安全性能息息相关,连接器失效会导致整体设备出现故障,造成严重的经济损失。其中,接触失效是连接器主要失效模式,导致接触失效的原因有接触压力、载流温升、振动应力等方面因素。本文以PCB端子为研究对象,分析其失效机制和测试方法,并利用有限元软件ANSYS模拟其工作过程,旨在提高产品连接可靠性。主要研究内容如下:分析PCB端子结构特点以及应用环境,选用C1100和C70250作为插片和端子材料。对PCB端子接触过程进行仿真,对比发现,产品插入力较大、前后端接触不均。因此,建立响应面法优化端子结构参数,选择前端间隙D、后端间隙E和后端长度M作为优化参数,以最大插拔力F1和前后端压力差F2为优化指标。经优化获得较优结构参数,即前端间隙为0.48mm,后端间隙为0.45mm,后端长度为4.20mm,此时最大插入力为27.14N,比优化前降低了19.12%,前后端压力差为15.20N,对比优化前有明显改善。建立PCB端子接触电阻等效模型,对产品进行电热耦合仿真,得到10A-50A电流下的温升数据,根据仿真结果,产品最高额定电流为35A,温升为29.63℃。对PCB端子进行模态分析,得到各阶固有频率,其中最低1阶频率为540.27Hz,大于产品最高工作频率500Hz,由此判断产品共振情况较少,随后进行随机振动分析,结果显示产品最大振动应力为42.39MPa,最大变形为0.004mm,均在接受范围内,由此判断产品可以承受随机振动影响。本文主要针对PCB端子进行可靠性分析和结构优化,将优化结果应用于实践生产,通过插拔力测试和温升测试验证了数值模拟和优化方案的可靠性,为之后同类产品的设计制造提供一定参考。更多还原

【Abstract】 Connectors are basic components in electrical equipment and are widely used in aerospace,military,and automotive fields.Their connection reliability is closely related to the safety performance of the system.Failure of the connector will cause the overall equipment to malfunction and cause serious economic losses.Among them,contact failure is the main failure mode of the connector.The causes of contact failure are contact pressure,current-carrying temperature rise,vibration stress and other factors.This paper takes PCB terminal as the research object,analyzes its failure mechanism and test method,and uses the finite element software ANSYS to simulate its working process,aiming to improve the reliability of product connection.The main research content is as follows: Analyze the structural characteristics and application environment of PCB terminals,and choose C1100 and C70250 as the insert and terminal materials.The PCB terminal contact process was simulated,and the comparison found that the product insertion force was large and the front and back ends were not evenly contacted.Therefore,the response surface method is established to optimize the terminal structure parameters,the front-end gap D,the back-end gap E,and the back-end length M are selected as the optimized parameters,and the maximum insertion force F1 and the front-end pressure difference F2 are used as the optimization indicators.Optimal structure parameters are obtained after optimization,that is,the front-end gap is 0.48 mm,the back-end gap is0.45 mm,and the back-end length is 4.20 mm.At this time,the maximum insertion force is27.14 N,which is 19.12% lower than before optimization,and the pressure difference between the front and back ends.It is 15.20 N,which is significantly improved compared to before optimization.Establish the equivalent model of PCB terminal contact resistance,conduct electro-thermal coupling simulation of the product,and obtain the temperature rise data under the current of 10A-50 A.According to the simulation results,the maximum rated current of the product is 35 A,and the temperature rise is 29.63 ℃.The modal analysis of the PCB terminal is performed to obtain the natural frequencies of each order.The lowest frequency of the first order is 540.27 Hz,which is greater than the product’s maximum operating frequency of 500 Hz.It can be judged that the product has less resonance,and then random vibration analysis is carried out.The result shows the maximum vibration of the product.The stress is 42.39 MPa,and the maximum deformation is 0.004 mm,which are all within the acceptable range.From this,it is judged that the product can withstand the influence of random vibration.This paper mainly conducts reliability analysis and structural optimization for PCB terminals,applies the optimization results to practical production,and verifies the reliability of the numerical simulation and optimization scheme through plug-in force test and temperature rise test,and provides a certain degree for the design and manufacture of similar products in the future.reference.更多还原