【作者】 刘浩；

【导师】 姜军；

【作者基本信息】 北京邮电大学 ， 信息与通信工程， 2016， 硕士

【摘要】 本课题设计实现某通信终端测试仪表硬件平台的数据收发处理板卡。板卡主要的功能和难点包括:实现PCIe、SRIO等高速交换链路,最高传输速率达到6Gbps;提供COME对外接口;提供电源、时钟、复位、管理和板卡固件在线升级等功能。作者完成了板卡的设计和实现,涉及板卡设计文档撰写、主要芯片选型、原理图设计、PCB设计和板卡调试。在原理图设计阶段,完成了主要芯片选型配置、板卡内部数据链路设计、对外高速接口设计和主要模块的设计与实现。PCB设计阶段,根据板卡尺寸结构和整体需求,进行了设计开发。对制作完成的板卡进行了焊接和调试,并撰写了测试报告。论文第一章绪论,介绍了论文选题背景及论文的整体结构;第二章需求分析与总体设计,分析仪表结构和板卡需求,完成板卡概要设计和主要芯片选型、配置;第三章板卡原理图设计,设计实现了板卡内部数据链路模块、接口模块、电源模块、时钟模块、复位模块和存储模块六个主要模块;第四章板卡PCB设计,实现了板卡基材选择、叠层结构设计、元件布局设计、布线设计和电源平面划分设计;第五章板卡调试,对时钟、电源模块和主要高速接口进行了调试,测试结果满足设计要求;第六章总结,根据板卡现阶段的进展,提出了总结与展望。本课题研究板卡达到设计目标,应用于仪表中,支持多模多通道的测量需求,具有现实意义。更多还原

【Abstract】 The subject of this thesis is to design and implement a data transceiver processing board for a hardware platform of testing instrument for communication terminal.The main functions and difficulties of the board include:1.Implementing high-speed switching link whose maximum transfer rate is up to 6Gbps of PCIe,SRIO,etc.2.Providing COME external interfaces.3.Providing power,clock,reset,management functions and board firmware upgrading online function,etc.The author completed the design and implementation of this board.It includes writing the design document for the board,selecting the major chips,designing the schematic diagram and PCB and debugging for the board.During the implementation of the schematic diagram,the author finished the work about selecting and configuring for the major chips,designing for the internal data link and external high speed interfaces of the board and designing and implementing for the key modules.During the implementation of the PCB,the author finished the work about designing and developing the PCB according to the board size,board structure and overall demand.For finished board,the author welded it,debugged it and wrote a test report for it.The first chapter introduces the background and overall structure of this paper.The second chapter is about the demand analysis and overall design.It includes analyzing for the instrument structure and board demand,finishing the overall design,major chip selection and configuration.The third chapter is about the design of the dramatic diagram.It includes designing and implementing for the following six modules:the internal data link module,interface module,power module,clock module,reset module and storage module.The fourth chapter is about the design of the PCB.It includes selecting for the board substrate,laminated structure design,original layout design,layout design and power plane division design.The fifth chapter is about board debugging.It includes debugging for the clock module,the power module and the main high-speed interfaces.The test results meet the design requirements.The sixth chapter is about summary.It proposed the summary and outlook according the status of the board.The board meets the design goal and is used in the instruments now.It supports measuring in multi-mode and multi-channel.It has a very significant effect on reality.更多还原