【作者】 刘强；

【导师】 廖进昆； 董小春；

【作者基本信息】 电子科技大学 ， 工程硕士（专业学位）， 2017， 硕士

【摘要】 成像系统一直是科研、工业领域不可或缺的重要装置,在航空航天、军事、民用等方面得到广泛的应用。传统的光学成像系统几乎都是采用光学冷加工的方法制作的,体积大与重量大,不能满足未来成像系统的需求。上世纪80年代,随着微光刻技术的发展,颠覆传统成像系统性的衍射元件、微光学元件成像元件系统得到了很快的发展,其主要优点是体积小、重量轻,在军事和民用方面得到了大量的应用,但同时也存在着衍射极限的限制。随着社会的发展,IC技术、微光学技术、MEMS技术、薄膜技术等新技术的出现和发展,学科交叉越来越显著。基于现有的工艺技术,本文主要针对亚波长多孔结构成像系统元件的研制进行了关键工艺性研究。首先介绍了一种特殊亚波长多孔结构成像系统元件的研制现状和未来发展态势。根据光的电磁理论,讨论了多孔结构的电磁分布,得到了多孔结构对波长相位的调制方法:孔横向尺寸和纵向尺寸变化。在理论的指导下,结合实验室工艺情况,最终采用孔横向尺寸变化的相位调节方式来加工多孔成像元件。在亚波长多孔成像元件实现方面,结合多学科工艺现状,分析了具体关键工艺实现方法,设计了具体工艺实施流程,并给出相应工艺流程图。为了达到预定的成像效果,根据课题组多年的工作经验,对亚波长多孔结构成像元件关键加工工艺环节进行了详细的误差分析,得到了降低误差的方法。随后详细介绍了元件的关键加工工艺环节:镀膜、键合、光刻、深刻蚀、电镀等。最终完成了工作中心波长10.6μm,焦距100mm的亚波长多孔结构成像系统元件。本文最后对加工的亚波长多孔结构成像元件进行了成像实验,以微结构光栅和测量尺为物,得到了相应的成像结果,基本达到了亚波长多孔结构成像元件研究的预期设计目标,同时,对光学成像元件的成像不足之处进行了分析。随着微纳加工和MEMS技术的不断发展,相信不久的将来,亚波长多孔结构成像元件性能会越来越好,将达到实用化的要求。更多还原

【Abstract】 Imaging systems always play an important role in scientific research and industries.They have been widely used in many fields such as aerospace,military,civil etc.Traditional imaging systems,which are almost fabricated by optical cold processing methods,are too enormous and heavy to satisfy the needs of future systems.In the 1980 s,with the development of micro-lithography,diffractive elements and micro-optical systems which subvert those traditional imaging systems developed rapidly.Because of small size and light weight,they have got broad applications of military and civil.Nevertheless,their imaging qualities are restricted within the diffraction limit.With the development of lithography,MEMS,thin film technology and microelectronics,interdisciplines have become a trend.Based on these mature technologies,a study of the processing methods of the sub-wavelength hole arrayed metallic(WV-SHAM)imaging element is presented in this thesis.The electromagnetic pattern of the hole arrayed structure is discussed and the result shows that the phased modulation has relation with the width and depth of the holes.Considering both the theories and our lab’s condition,a width variable sub-wavelength hole arrayed metallic lens is manufactured.For completing this lens,the specific technical process is designed and the corresponding flow chart is illustrated.In order to achieve the imaging effect,the errors of the key processing steps are analyzed based on my years’ working experiences.According to the error compensation calculations from device’ design to fabrication,a series of methods to reduce the errors are presented.The particular operations during processes such as coating,bonding,lithography,DRIE and electrochemistry are presented in detail.Finally,a WV-SHAM lens(f=50mm @10.6μm)is fabricated.The imaging test experiment of this WV-SHAM lens is done to prove our design right and the result is also analyzed.It is believed that the practical implementation of the sub-wavelength hole arrayed metallic imaging element will come one day.更多还原