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低功耗MEMS热式风速传感器的研究
Research of Low-Power MEMS Thermal Wind Sensor
【作者】 苏玲;
【导师】 秦明;
【作者基本信息】 东南大学 , 微电子学与固体电子学, 2016, 硕士
【摘要】 近年来人们在热式风速传感器的研究和发展方面已经取得了很大的进展,其产品已被广泛地应用于工农业生产、气象测试、环境保护、生物医学、汽车以及居室、温室环境控制等诸多领域。在热式风速传感器问世以前,人们主要依靠机械类的传感部件来测量风速。而当热式风速传感器的制作技术与现行的集成电路制作技术相兼容时,不仅可以降低生产成本、实现成批量地生产,还可以将信号处理电路和热式风速传感器制作在同一芯片上,从而就能生产出集成智能型热式风速传感器。本文提出了一种基于硅通孔技术的低功耗MEMS热式风速传感器,其中低热导率材料玻璃作为传感器的衬底,硅通孔作为导电通路。本文设计的传感器具有封装简单、热隔离效果好、可低功耗工作等优点,能在低于250mW的系统功耗下达到30m/s的风速量程,且精度满足±(0.5m/s+5%*W)。具体内容如下:首先,本文对国内外在降低MEMS热式风速传感器功耗方面的研究进行了分析,概述了降低功耗的三种方法:一是优化传感器的结构;二是选择低热导率的衬底材料和高性能的温度敏感材料;三是改进传感器的控制模式和电路。本文结合了第二种和第三种方法来降低系统功耗。通过仿真优化传感器的尺寸,将传感器制造在玻璃基板的正面,传感器的敏感结构通过硅通孔实现到信号处理电路的电连接,这样可以减小传感器由于热传导而损失的热量,提高传感器的灵敏度,简化了封装工艺,提高传感器电连接的可靠性。其次,对基于硅衬底和陶瓷衬底传感器的硬件控制电路进行了功耗分析,确定硬件控制电路的简化方案。以新设计的低功耗传感器为对象,分别设计了CP模式和CTD模式下的硬件控制电路,并分析其功耗与性能的关系。CP模式下的传感器加热功耗为11.52mW,硬件电路功耗为153mW。CTD模式下传感器加热功耗为101.56mW-148.73mW,硬件电路功耗为92.85mW。最后,对传感器样品进行了功耗和量程、稳定性等性能的测试,并对两种模式下的功耗和性能进行了对比。CP模式下的传感器功耗较低且稳定,但灵敏度较低,且有严重的温漂现象;CTD模式下的传感器虽然功耗动态范围较大,但灵敏度较高,且一定程度上抑制了温漂。然后分析传感器仍然存在的问题以及提出了后期的解决方案。
【Abstract】 Great progress has been made in research and development of thermal wind sensor in recent years, and products have been widely used in many fields such as industrial and agricultural production, meteorological testing, environmental protection, biological medicine, automobile, and the greenhouse environment control. Before the advent of thermal wind speed sensor, mechanical sensing parts are mainly used to measure wind speed by people. When the techmology of making thermal wind speed sensor can be compatible with the integrated circuit production technology, not only the production cost can be reduced, and volume production can be realized, but also signal processing circuit and thermal wind speed sensor can be produced on the same chip, after that integrated intelligent thermal wind speed sensor can be possible.A low-power MEMS thermal wind speed sensor baed on the technology of through silicon via is introduced in this paper, with low thermal conductivity material glass as substrate of sensor and through-silicon-via as conductive path. This kind of sensor has advantages such as simple packaging, heat isolation and low-power. The wind speed ranges from 0 to 30m/s, satisfying the requirement for precision of 0.5m/s+5%, while the power of the system is less than 300m W. The main work is as follows:First of all, the research about reducing the power consumption of MEMS thermal wind speed sensor at home and abroad is analyzed in this paper. Three methods of reducing power consumption are summarized.Include:the optimization of the structure, choosing the substrate material with low thermal conductivity and temperature sensitive material with high performance, improving circuit control mode of the sensor. In this paper, the second and the third way are combined to reduce the power consumption of the system. By simulation the size of the sensor is optimized, sensor is made in the front of the glass substrate and the sensing structure is connected to the signal processing circuit by silicon via. Therefore, the heat loss caused by heat conduction can be reduced, and the sensitivity of the sensor can be improved. By the same time, the packaging process is simplified and the reliability of electric connection can be raised.Then, the power consumption of the hardware control circuit of thermal wind speed sensor which is based on silicon substrate or the ceramic substrate is analyzed, by which the program of simplifying the hardware control circuit can be determined. With the low-power sensor as the object, hardware control circuit of CP mode and CTD mode are respectively designed to analysis the relationship between the power and performance. Under CP mode, heating power consumption of the sensor is 11.52 mW and power consumption of hardware circuit is 153 mW. Under CTD mode, heating power consumption is from 101.56 m W to 101.56 mW and power consumption of hardware circuit is 92.85 mW.Finally, the sensor is tested to measure the power and the performance such as range of the sensor and stability, which of the two modes are compared. The sensor with CP mode has low and stable power consumption, while the sensitivity is low and serious temperature drift phenomenon exists; Dynamic range of the power consumption is large when sensor works under CTD mode, but the sensitivity is higher and to some extent the temperature drift can be controlled. Then problems are analyzed and solutions can be put forward in the late.