【作者】 张峰；

【导师】 王忆文； 苏静洪；

【作者基本信息】 电子科技大学 ， 软件工程 （专业学位）， 2016， 硕士

【摘要】 双面抛光机主要适用于磁性材料、半导体硅片、锗片、光学玻璃、金属材料及其它硬性和脆性材料的两面高精度高效率的抛光。抛光原理为四动模式;两个电机分别拖动上下两个抛盘、太阳轮、内齿圈;设定控制采用PLC调整;人机界面系统的显示使用彩色NT。龙门结构为箱形,配置大功率减速系统,软启动、软停止,运转平稳,抛光时间根据计时器可随意设定,采用了自动供给抛光液装置。为了防止抛光过程对零件的破坏,在与抛光液接触的零部件选用了防腐材料或表面进行了特殊处理。通过联合精密型传感器与气动控制的高精密系统,使得压力形成闭环反馈控制,以保证工件压力的准确性。采用了强制集中润滑对主要运动副进行润滑。抛光液系统具有多个辅助功能系统,包括独立搅拌系统、循环水冷却功能、给抛光液升温以及检测抛光液实时温度等功能,我们可选配不同的功能制做。双面抛光加工是晶片超平滑表面加工的有效途径,受到了人们的广泛关注,如何有效的获得晶片超平滑表面成为了各界专家学者研究的热点。双面抛光机气动加载系统能够对晶片超平滑表面加工进行精确的控制,提升晶片超平滑表面加工的质量。加载装置是双面抛光加工的重要组成部分,决定了晶片超平滑表面加工的质量,本文依据实际的需求,对双面抛光加工的控制系统进行了设计与实现。本文首先对双面抛光机的基础理论进行了介绍,对控制理论进行了研究;针对系统的硬件设计与软件设计分别进行了详细的阐述,对系统的功能与任务划分进行了分析;文章以双面抛光机为研究对象,提出了手动和自动控制两种工作模式,设计了软件的总体方案和系统的程序;针对整套系统的抛光机,监控系统尤为重要,我们对其进行了设计,实现了系统的实时监控与维护;最后对系统的界面进行了设计,确定了画面之间的切换关系。通过对系统的调试之后,验证了系统功能运行正常,满足事先既定的功能目标,系统在运行中具备了较强的稳定性,满足了晶片超平滑表面加工的要求,提升了晶片超平滑表面加工的质量。通过对本系统的设计与实现,希望为今后的双面抛光加工控制系统的研究奠定基础。更多还原

【Abstract】 Double-sided polishing machine is mainly suitable for semiconductor silicon wafers, magnetic materials, sapphire, optical glass, metal and other hard brittle materials double-sided high-precision high efficiency polishing processing. With four dynamic polishing principle; 2 motor drag respectively in selling, the sun wheel, gear ring; PLC adjust set control; Color NT showing the human-machine interface system. Longman box construction with high power reduction system, soft start, soft stop, smooth operation, polishing time according to the timer can be set at random, using the automatic polishing liquid supply device. Parts in contact with the polishing liquid chose anticorrosive material or surface has carried on the special treatment. By precision weighing sensor with high precision pneumatic control system to realize the pressure closed loop feedback control, to ensure the accuracy of the stress of workspace. Major sports vice adopted forced lubrication. Polishing liquid system with independent stirring, circulating water cooling, polishing liquid heating and polishing liquid temperature detection function, the function is optional.Two sided polishing process is an effective way to smooth the surface of the wafer, and has received extensive attention. How to effectively obtain the smooth surface of the wafer has become a hot spot of the experts and scholars of all walks of life. The pneumatic loading system of the double side polishing machine can accurately control the super smooth surface of the wafer, and improve the quality of the super smooth surface of the wafer.The loading device is an important part of the double side polishing process, which determines the quality of the super smooth surface of the wafer. In this paper, the control system is designed and implemented according to the actual demand. Firstly, this paper introduces the basic theory of the double side polishing machine. The control theory is studied. The hardware design and software design of the system are described in detail. The function and task of the system are analyzed; In this paper, a double side polishing machine is studied. Two working modes of manual and automatic control are put forward. The overall scheme of the software is designed, and the program of the system is designed; the polishing machine monitoring system is designed to realize the real-time monitoring and maintenance of the system. At last, the interface of the system is designed to determine the switching relationship between the screen and the system.After debugging the system, it is proved that the system function is running normally, meet the predetermined functional objectives, the system has a strong stability in operation, meet the requirements of the wafer super smooth surface processing, and enhance the quality of the wafer super smooth surface processing. Through the design and implementation of this system, we hope to lay the foundation for the future research of the two sided polishing process control system.更多还原