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金属铜基底上微—纳结构超疏水表面的电化学制备
Electrochemical Preparation of Micro-nano Structured Copper-based Superhydrophobic Surfaces
【作者】 赵伟;
【导师】 李则林;
【作者基本信息】 湖南师范大学 , 物理化学, 2016, 硕士
【摘要】 近年来,具有超疏水性能的材料越来越受到关注,其主要应用在自清洁表面、防腐蚀、流体减阻、防结冰、防水涂层/面料和油水分离等方面。铜作为一种普遍使用的金属材料,它的表面超疏水研究也引起人们的广泛兴趣,因此,如何简单、快速和低成本在常用金属铜基底上制备超疏水表面是一个重要研究课题。本文通过电化学方法成功在金属铜基底上制备了Cu2S/CuS,Cu2O/Cu2S和Cu/Cu2Se微-纳结构薄膜,其表面具有超疏水性质。主要内容有:1.方波电势脉冲法制备微-纳结构Cu2S/CuS超疏水表面:以金属铜电极为基底,以NaOH溶液为底液,利用方波电势脉冲方法粗糙电极表面,再用Na2S溶液硫化电极表面,成功制备Cu2S/CuS超疏水薄膜。此薄膜经彻底清洗干燥后无需修饰任何低表面能物质即具有超疏水性,水滴的最大接触角为157.5°。2.方波电势脉冲法在铜基底上快速制备微-纳结构Cu2O/Cu2S超疏水表面:以金属铜电极为基底,以Na2S2O3溶液为底液,利用方波电势脉冲方法处理铜电极,得到Cu2O/Cu2S超疏水复合薄膜。此薄膜经彻底清洗干燥后无需修饰任何低表面能物质即具有超疏水性,水滴的最大接触角为160°。3.一步法快速电化学制备微-纳结构Cu/Cu2Se超疏水表面:以金属铜电极为基底,以Na2SO4和Na2SeSO3混合溶液为底液,利用恒电势处理铜电极,成功制备草莓状Cu/Cu2Se微球阵列超疏水薄膜。此薄膜经彻底清洗干燥后无需修饰任何低表面能物质即具有超疏水性,水滴的最大接触角为164°。
【Abstract】 In recent years, superhydrophobic surfaces have attracted more and more attention due to their wide applications in self-cleaning coatings,anti-corrosion, flow drag reduction, anti-icing, water-proof coatings/fabrics, oil-water separation, and so on. Copper is a kind of widely used engineering metal and its surface superhydrophobicity is of wide interest.In this thesis, we try to develop some facile electrochemical methods to prepare superhydrophobic copper metal surfaces with micro/nanostructured coatings of Cu2S/CuS,Cu2O/Cu2 S and Cu/Cu2 Se.(1) Superhydrophobic Cu2S/CuS surfaces on Cu substrate can be facilely fabricated by square-wave potential pulses in NaOH solution and subsequent sulfurization in Na2 S solution. The maximal CA can reach157.5° without any post-treatment and surface modification.(2) Superhydrophobic Cu2O/Cu2 S surfaces on Cu substrate have been prepared by square-wave potential pulses in Na2S2O3 solution. And a maximum contact angle of 160° was achieved without performing surface modification.(3) Superhydrophobic Cu/Cu2 Se surfaces on Cu substrate have been prepared by treating the Cu electrode under constant potential in a mixed solution of Na2SO4 and Na2SeSO3, and the maximum contact angle was164° without performing surface modification.
【Key words】 electrochemistry; square-wave potential pulses; superhydrophobicity; metal copper; micro/nanostructure;