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晶圆传输机器人末端执行器设计与关键技术研究

Design of Wafer Handing Robot End-effector and Key Technique Research

【作者】 刘洪涛

【导师】 郝丽娜;

【作者基本信息】 东北大学 , 机械工程(专业学位), 2012, 硕士

【摘要】 半导体加工制造业要求加工运输设备需要具有高洁净等级、防静电、高可靠性等特点,所以半导体制造环境下所用的机器人在满足基本搬运要求的同时还要兼顾上述特点,晶圆传输机器人在半导体制造业地位非常重要,所以有必要对其进行系统的研究。本文主要工作如下:(1)分析R-θ型晶圆传输机器人的主体结构,对末端执行器的重要性能指标,即晶圆在支撑接触时的变形进行了分析,奠定了末端执行器的设计方向,确定了末端执行器的设计方式和具体构型,完成了对满足工位要求的末端执行器的设计,并对先前的设计进行了改进。(2)建立了晶圆传输机器人系统的动力学模型,并在此基础上进行了计算分析,得出了机器人系统各参数的表达式,对同步带等效扭转弹簧的振动模型进行了分析,在电机轴端建立了振动控制模型,并仿真分析,得出了机器人末端执行器振动影响因子,为振动抑制提供了控制算法基础。(3)针对机器人系统设置误差参数,建立数学模型,通过仿真分析计算验证了标定算法的可行性,编写了标定实验程序,搭建了实验系统,通过CCD图像识别对晶圆传输机器人进行了标定实验,验证了机器人过程运行精度的合理性。(4)辨识晶圆传输机器人与预对准机器之间的坐标系相对位姿,辅助预对准机对晶圆的加工处理。分别对机器人和预对准机的坐标系的相对位置和相对姿态两个方面进行参数识别方案的设计,通过识别出的坐标系位姿参数对机器人进行参数补偿,大大缩短了机器人与预对准机之间晶圆的传输与处理的时间,提高了晶圆的生产效率。

【Abstract】 Semiconductor manufacturing requires equipments which runs in the super clean room should have the character of super clean class, anti-static and high reliability. So, the robot working in the semiconductor manufacturing should have the ability of handling wafer and the character as said above. Moreover, silicon wafer handling robot is important in the semiconductor manufacturing. Thus, there is necessarility to analyze the robot for silicon wafer handling.The main research works are as follows:(1) The main structure of R-θ silicon wafer handling robot and the transformation of silicon wafer when it is clamped by robot end effector are analyzed. We confirm design direction, design way and detailed structure of robot end effector. The design of robot end effector which is satisfied to processing stations is accomplished. We improve the previous design and make it better.(2)Establish a dynamics model for silicon wafer handling robot and get all the parameters expressions by calculating and analyzing the dynamics model. The timing belts are equivalent to torsion spring. It is a vibration model of robot system. After calculating and analyzing for the vibration model, establish vibration-control model. By simulating and analyzing the vibration-control model, get control algorithm about restraining the vibration of robot system.(3)Set robot system’s error parameters and establish mathematical model. Test and verify the feasibility of calibration arithmetic by calculating and analyzing. Then redact procedure about calibration experiment and set up experiment system. Accomplish the calibration experiment of robot system by CCD. Through the above-mentioned word, we test the rationality of robot’s process-running precision which can ensure silicon wafer arrive the correct position.(4)Identify the coordinate systems of silicon wafer handling robot and silicon wafer aligner. It is very important to assist calibration of silicon wafer aligner and ensure silicon wafer arrive the correct position. Redact procedure about associated operation between silicon wafer handling robot and silicon wafer aligner, and recognition algorithm is accomplished too. Through the above-mentioned word, the silicon wafers’positional precision is improved greatly.

  • 【网络出版投稿人】 东北大学
  • 【网络出版年期】2014年 07期
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