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在泡沫镍基体上电泳沉积金刚石颗粒制备多孔金刚石工具
Preparing Porous Diamond Tools via Electrophoretic Deposition of Diamond Powder on Foam Nickel Substrate
【作者】 李翔;
【导师】 臧建兵;
【作者基本信息】 燕山大学 , 材料学, 2012, 硕士
【摘要】 本文利用电泳沉积(Electrophoretic Deposition—EPD)技术将金刚石微粉沉积到多孔泡沫镍基体上,然后向带有金刚石涂层的基体上化学镀金属镍以制备多孔金刚石磨具。探讨了各种工艺条件对涂层及镀层制备的影响,并对试样进行了扫描电镜分析,抗折强度测试以及磨削性能测试。金刚石微粉电泳沉积性能的研究显示,电场强度在3~8V/cm之间,金刚石微粉可以电泳沉积到阳极泡沫镍上。随着电场强度的增加,单位时间金刚石颗粒的沉积量不断上升,沉积速度增加。但电场强度超过6V/cm后,金刚石颗粒的沉积速度的增加变缓。电泳时间延长,金刚石层增重提高,电泳20min后,金刚石颗粒由于电场屏蔽的作用便不再继续向基体上沉积。在6V/cm的电场中,电泳20min,在多孔泡沫镍基体上获得了均匀完整的金刚石涂层。金属镍的化学镀性能研究显示,当pH值为8温度为70℃时镀层外观光亮,表面光滑,没有缺陷。通过对电泳以及化学镀工艺参数的控制,使镀层中金刚石与Ni的体积比为1:1,获得的金刚石EPD层可以被镍镀层很好的固结在基体上,不会出现镀层中Ni太少使得金刚石固定不住而脱落,或者Ni太多金刚石被埋在镀层内部。而且抗折强度有着显著的增加。利用制备的多孔金刚石工具做磨削性能测试,证明所制备的多孔金刚石工具具有良好的磨削性能。
【Abstract】 In this paper, porous diamond grinding tool was prepared via electrophoreticdeposition (EPD) of diamond micro-power and followed electroless plating Ni on a nickelfoam substrate. The influences of the EPD and the plating conditions on the diamondcoatings were investigated. The morphology of the coating was characterized by fieldemission microscope(FE-SEM). The bending strength and the wear resistance ratio of thesamples were measured.The EPD results show that diamond micro-powder was deposited on foam nickelanode at the electric fields of3~8V/cm. The weight increment of EPD layer increasedwith the field intensity and EPD time. However, when the field intensity was beyond6V/cm or the time was larger than20min, the EPD velocity did not increase any moreowing to electric field shielding. A uniform diamond layer on porous foam nickel substratewas obtained at6V/cm after depositing for20min. The FE-SEM photos reveal that the Nicoating obtained by electroless plating had a smooth surface and a bright appearance at thepH of8and the temperature of70℃.The volume ratio of diamond micro-power and Ni can be adjusted by controlling theconditions of the EPD and the electroless plating processes. The diamond micro-powercould be well hold on the substrate when the volume ratio of diamond micro-power and Niin coating was about1:1. Diamond micro-powder easily dropped from the substrate withlittle Ni coating, on the contrary, diamond particles can not protrude above the substratewith too thick Ni coating.The grinding tests show that the prepared diamond-Ni/foam nickel composite had agood grinding performance. It can be used as porous diamond grinding tool.
【Key words】 electrophoretic deposition; electroless plating; foamed nickel substrate; composite coating; diamond abrasives;