【作者】 王倩；

【导师】 汪辉；

【作者基本信息】 上海交通大学 ， 软件工程， 2006， 硕士

【摘要】 随着集成电路制造技术的迅猛发展,干法刻蚀技术,早已在特征图形形成方面,成为最主要的工艺技术之一。本文主要围绕金属互连层的干法刻蚀技术,分别针对不同的腔体,从工艺条件开发和评价的角度,展开研究。在金属刻蚀方面,围绕干法刻蚀中最重要的刻蚀条件评价环节,针对铝配线分布在30%以下的特征图形,通过研究工艺参数与刻蚀参数之间的关系(即,气体流量、功率、压力、温度等工艺参数变化时对刻蚀速率、选择比、均一性甚至颗粒的影响),成功解决微负载效应引起的底部侧向过刻问题,最终获得能准确控制特征图形并适合量产的优质的工艺条件。针对该种铝配线分布的特征图形刻蚀,本次研究为同行业提供了可供参考的通用模板。同时,该研究项目中所涉及的评价和分析方法,也为准确确立和优化干法刻蚀工艺条件,提供了极有价值的参考。在去胶方面,研究并开发了一种新的腔体清洗工艺。利用等离子刻蚀的工艺方法,替代了传统的开腔清洗,解决了业界普遍存在的传统开腔清洗下机台停滞和延缓生产等重大问题。在工艺稳定性、量产效率、部件损耗、颗粒控制等多方面表现出比传统清洗方法更为优越的品质。该研究从初期选材(工艺气体、假片等),工艺条件调试到中期工艺条件优化;从数据采样,参数分析到评价方法,整个研究过程较完整连贯,为同行业中相关课题的研究,提供了很好的技术参考。同时,由于研究中涉及了大量的数据分析,并进行了较为全面的工艺确认,以至最终该清洗工艺的研究成果,可以顺利的应用于大规模量产,体现了其实际的应用价值。更多还原

【Abstract】 With the rapid development on fabrication of Integration Circuit Technology, Dry Etch has become one of the most major technology on the patterned etch. In this paper, we studied metal etch through the process development and evaluation on each process chamber.On metal etch aspect, we studied the relationship of process parameter. Through plenty of experiments, we finally solved the over etch problem on the bottom side of aluminum pattern which is caused by micro-loading effect. We also made the reference module for the special pattern (only 30% coverage of aluminum ). This study also provides valuable method on the recipe optimizing for the professional analysis and evaluation.On ash aspect, we developed a new process for chamber cleaning. Instead of usual physical wet cleaning, this new process can utilize the plasma etch to clean the ash chamber successfully. Compared with traditional method, it has better quality on process stability, efficiency, parts consumption, particle control and etc. From the initial evaluation to final recipe optimization, the whole studying is complete and continuous. And based on plenty of data analysis and comprehensive process confirmation, the good performance on this subject can be successfully applied in mass production.更多还原