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硅片调焦调平测量系统性能测试方法研究

Research on Evaluating the Performance of Wafer Focusing and Leveling Sensor

【作者】 金小兵

【导师】 李小平;

【作者基本信息】 华中科技大学 , 机械制造及其自动化, 2007, 硕士

【摘要】 信息产业已经成为我国国民经济发展的支柱产业,集成电路是信息产业的基石,集成电路的发展离不开设计、工艺和装备技术的支持,而投影光刻机是现代集成电路制造的核心装备。因此,研究光刻机核心技术之一的调焦调平测量技术具有理论和实际意义。调焦调平测量系统测量硅片表面相对投影物镜的高度和倾角,与工件台垂向执行器构成反馈来精确地控制曝光硅片的位置。本文着力于解决因光刻机调焦调平测量系统失效导致投影物镜工作在离焦状态而影响硅片曝光质量的问题。基于调焦调平测量系统的复杂性,本文提出以激光干涉仪作为主要测量仪器,采用相对位置测量法,通过比较激光干涉仪和硅片调焦调平测量系统分别对承片台和硅片运动量的测量结果来评价调焦调平测量系统的性能,并通过算法对激光干涉仪因环境温度和气压波动而产生的测量误差进行补偿,有效地提高了测量精度和稳定性,实现了5nm的垂向测量精度。采用高精度三轴运动台驱动硅片模拟光刻机工件台的垂向运动,通过简化硅片高度和倾角的计算公式,建立了三自由度激光干涉仪测量模型。为了提高可靠性,对光刻机调焦调平测量系统性能测试时必须模拟光刻机的真实工作环境,采用温度控制单元和超级测温仪通过温度控制算法严格控制测量环境温度,并采用主动减振系统有效地隔离和控制振动。在本文理论基础上所搭建的测试平台为光刻机调焦调平测量系统提供了模拟运行环境,在该平台上可以对光刻机调焦调平测量系统的测试范围、测量精度、分辨率及重复性测量精度等多项性能指标进行检测,同时,测试平台还可对调焦调平测量系统因机械变形、温度漂移等诸多因素所引起的误差进行校准和修正,可满足100nm分辨率光刻机调焦调平测量系统性能测试的需求。

【Abstract】 Information industry plays a mainstay role in development of national economy, but it depends on the Integrated Circuit technology which is pushed forward by design, process and equipment. The optical lithography tool is the key equipment for fabrication of IC. Being one of the critical subsystems of lithography tool, focusing and leveling sensor is worth researching. Focusing and leveling sensor is used to detect wafer position with respect to the lens, and feeds back to wafer stage. So, wafer stage can accurately control the position of wafer surface. The thesis is trying to resolve the problem that the lithography tool working in defocus state because of the failure of the focusing and leveling sensor.Due to its complexity, it takes the laser interferometer as the main instrument, the performance of focusing and leveling sensor can be evaluated by comparing its result with the result measured by laser interferometer. Then an appropriate algorithm is used to compensate the error which resulted by the fluctuating of the temperature and the pressure, then, the measuring accuracy and stability are improved obviously, and it reaches 5nm measurement accuracy in vertical. A super precision stage with 3 axes simulates the exposure chuck to drive wafer. The three-dimensional measurement module of laser interferometer is established by simplifying the formula to calculate the height and the rotation of wafer.For the high reliability, it must simulate the lithography’s working conditions, the Temperature Control Unit and the temperature measuring appliance are used to control the environment temperature with an algorithm, and the error which resulted by the vibration is eliminated by the shock-absorbing system.A test bench is built on account of the theory advanced by the thesis, the test bench provides a simulated condition for the focusing and leveling sensor, and it can be used to evaluate the accuracy, resolution and repeatability of the sensor with its high performance. With the exception of this, the test bench can correct the error resulted by the deforming of mechanical structure and the drifting of temperature. So, it improves the lithography tool’s performance and efficiency, and can be used to evaluate the focusing and leveling sensor’s performance in 100nm resolution lithography tool.

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