【作者】 马豪；

【导师】 张鸿海；

【作者基本信息】 华中科技大学 ， 精微制造工程， 2007， 硕士

【摘要】 LED粘片机是一种用于LED生产制造中进行管芯与引线框架粘接的自动化设备,融合了图像处理、模式识别、光电检测、控制理论、机电一体化等多学科内容和技术。是LED生产过程中的关键设备,其性能直接影响到所生产LED的性能、生产效率和产品的合格率。目前国内微电子封装设备主要依赖于进口,借鉴国外的先进仪器对LED粘片机关键技术进行了研究,该系统由进片机构、导轨传输机构、点浆机构、XY晶片台、顶针机构、拾取粘接机构、料盒机构等七大机构的机械结构模块,以及主控制模块、视觉定位模块等三大模块组成。在分析系统结构及工作原理的基础上,本文着重研究了LED粘片机主控制系统、视觉定位系统、晶粒拾取粘接时序控制等问题。其中的一些设计思想和方案具有一定的理论意义和实际应用价值。本文的具体内容如下:(1)分析了LED粘片机的工艺流程,确定了LED粘片机由机械结构模块、主控制系统模块和视觉定位模块组成。通过分析LED粘片机工作原理,设计出比较合理的运动流程图。(2)通过分析常用的上位运动控制方式,构架了以工业PC机和输入输出模版为基础,以基于PC总线的运动控制卡、步进驱动器和步进电机构成的主运动控制系统。负责各类输入、输出信号的管理和控制,并在检测传感器协助下控制和协调各执行模块完成预定的运动方式和精确位移。(3)采用了以图像采集卡、CCD摄像头和光学组件构成的视觉定位硬件系统,详细介绍了图像预处理和图像匹配技术,实现了对拾取粘接过程中的精确控制。(4)对控制系统软件从结构、功能任务等方面进行了系统的规划和设计,并对拾取粘接时序控制和电机标定的方法进行了研究。更多还原

【Abstract】 LED die bonder is automation equipment for contact LED chip with wire bonding framework, bringing together technologies and skills image processing, pattern recognition, photoelectric detection, computer control and electromechanical integration. Its performance makes great effect on the productivity, production efficiency and the passing rate products of LED.Packaging equipment domestic currently relies mainly on the import, we learn from the advanced equipment designed LED die bonder. LED die bonder is made up three modules. There are mechanical structure module, the main control module and visual positioning module. And mechanical structure module consists of the LED frame into and out of machine, leadframe transfer mechanism, XY wafer movement mechanism, eject pin, epoxyn dropping mechanism and picking adhesive mechanism. Based on the analysis of system structure and working principle, the design of control system, visual position system, control sequence of pick up and mount chip has been carried out. The specific contents are as follows:Firstly, the process of LED die bonder was presented; LED die bonder is made up three modules. There are mechanical structure module, the main control module and visual positioning module. By analyzing working principle of LED die bonder, the campaign is designed more reasonable flow chart.Secondly, a motion control sydtem base on industry PC, I/O borad, motion control borad, stepping driver and stepping motor has been established in this thesis, which is in charge of the management and handling of different input and output signals, controlling and coordinating all mechanisms to finish the set motion mode and the precise displacement with the assistance of detecting sensor.Thirdly, visual position system is made up of image capturing borad, CCD and optics parts. Image preprocessing and image matching technology were detailed briefly, for the precision control of the sticky admission process. Finally, the controlling software from structure, function and task, interfaces were planned and designed. Which more, we studied control sequence of pick up and mount chip and motor calibration method.更多还原