【作者】 马超；

【导师】 雷玉勇；

【作者基本信息】 西华大学 ， 机械电子工程， 2007， 硕士

【摘要】 微细加工技术是精密加工技术的一个分支，是指加工微小尺寸零件的生产加工技术。而磨料水射流加工是一种新型的冷加工技术，可以达到微纳加工级别。微细加工技术是现代加工技术中的重要研究课题之一，对于先进制造技术的发展具有重大的意义。本论文对微细加工技术，水射流技术和磨料水射流切割机理等内容进行了系统研究。较详细的分析、比较几种典型的微细加工方法。通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。由于水射流在加工过程中没有热反应区，可以达到较高的切割精度，特别在半导体行业中，较传统微细加工方法具有无可比拟的优越性。而且，水射流可以切割任意形状的工件，所以比传统的金刚石锯片切割有较高的优越性。本论文利用现有的水射流加工设备，通过对砷化镓等半导体材料和金属基合金材料的切割实验，对用磨料水射流切割加工半导体材料的可行性进行了研究，同时，对磨料水射流的加工精度，工件表面的粗糙度以及加工后工件的物理、化学性质变化，以及磨料对工件产生的微观影响进行了深入研究。研究表明，磨料水射流可以切割金属基合金，平均工作温度不高于100℃，会对工件的表面性状产生影响，但不会影响工件的内部组织，会产生明显微观切痕，可以用来切割半导体材料。本论文对水射流微细加工技术的研究和应用具有重要的理论意义和实用价值。更多还原

【Abstract】 Micromachining is one of the precision machining technologies. It means the technology of producing with parts micro size. Waterjet is a new precise and cold machining process. Micromachining technology is one of the important research subjects on the modern machining technology. It plays a vital role in the improvement of advanced manufacture.A systematic research on micromachining, waterjet technology and mechanism of abrasive water-jet were carried out in the thesis. Typical micromachining technologies were analyzedand compared. After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward. Because there is no heat-affected zone and it can achieve high cutting precision, abrasive waterjet is superior to traditional manufacturing, especially in semiconductor industry. In addition, omni-directional cutting can be made by waterjet, therefore it is better than traditional diamond saw cutting.Based on current waterjet machining, the experiments on semiconductor material cutting using abrasive waterjet, were carried out. The study on the feasibility of cutting semiconductor using waterjet is demonstrated. On the other hand, the phusical or chemical changes of work piece as well as the influences on IC performance after waterjet cutting are tested.The research indicates that the process of semiconductor cutting will be optimized by abrasive waterjet micromachining. The working temperature is lower than 100℃. Abrasive waterjet cutting has effect on the surface finish. It can’t destroy the internal structure of work pieces except for obvious kerf. In the end, it demonstrates that micro-abrasibe waterjet can be used to cut semiconductor materials.The results studied in the thesis have significant academic value and good applications in micro-machining of semiconductor chips.更多还原