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低电子阻抗环氧树脂的合成与性能

Synthesis and Properties of Epoxy Resin Compositions with Low Electronic Impedance

【作者】 王哲

【导师】 孙建中;

【作者基本信息】 浙江大学 , 化学工程, 2006, 硕士

【摘要】 本文首先用丙三醇与氧化钙在一定条件下发生反应,用磷酸作脱水剂,合成一种新的导电物质——金属钙络合离子中间体,再用金属钙络合离子中间体与双酚A型环氧树脂合成了低电子阻抗的环氧树脂,通过多元胺固化剂交联制备了低电子阻抗的环氧树脂固化物。测定了低电子阻抗环氧树脂固化物的体积电阻率、冲击强度、弯曲强度,以及固化物涂膜的硬度和附着力,并用DSC和TG分别测试了低电子阻抗环氧树脂的固化过程与固化产物的热稳定性,考察了金属钙络合离子中间体与环氧树脂的用量比及反应时间对固化物的体积电阻率的影响。研究表明,选择E-51作树脂基体,中间体:环氧树脂(质量比)=2:10,反应时间为3小时,固化物的体积电阻率达到最小值7.546×10~7Ω·cm,且加入金属钙络合离子中间体前后固化物的机械性能基本处于同一水平。由此可见,金属钙络合离子中间体的引入可使环氧树脂具备低电子阻抗性能,对固化物的机械性能无明显影响。在上述基础上,用活性稀释剂代替溶剂,将低电子阻抗环氧树脂稀释降粘,然后向其中加入颜填料并固化,制得无溶剂低电子阻抗环氧地坪涂料,考察了环氧地坪涂料的固含量及填料的配比对体积电阻率、冲击强度和弯曲强度的影响,找出环氧地坪涂料的最佳配方。按照最佳配方制备地坪涂膜,测量了涂膜的各种机械性能,结果表明,固含量为85,滑石粉:云母(质量比)=3:1时,固化物的体积电阻率达到最小值1.503×10~7Ω·cm,同时具有良好的冲击强度与弯曲强度,且涂膜的其它各项机械性能均达到各自的技术指标,制得的环氧地坪涂料能够满足实际应用。

【Abstract】 An epoxy resin composition with low electronic impedance was prepared using copolymerization and curing of bis-phenol A type epoxy resin (E-44, E-51), calcium ion complex intermediate, and ethylene diamine(EDA) and diethylene triamine (DETA). The bulk electronic resistance and mechanical properties of the composition were measured. The curing process and the thermal stability of the composition were analyzed by DSC and TG. The effects of the ratio of calcium ion complex intermediate to the epoxy resin and reaction time on the bulk electronic resistance of the low electronic impedance epoxy resin composition were investigated. The results showed that the epoxy resin could possess the property of low electronic impedance by using the metal ion complex intermediate, and that the effect of the intermediate on mechanical properties of the epoxy resin composition was not significant.Active thinner rather than solvent was added to the epoxy resin composition with low electronic impedance to decrease the viscosity, then some pigment and filler were added to the diluted epoxy resin, at last curing agent was added to prepare solvent-free epoxy floor paint with low electronic impedance. The effects of solid content in the epoxy floor paint and the mass ratio of talc to mica in the filler on the bulk electronic resistance, impactive intensity and flexural resilience were investigated, and the best formula was found out, when the solid content was 85 and the mass ratio of talc to mica was 3:1, the bulk electronic resistance got theminimum(1.503×10~7Ω·cm). The mechanical properties of the epoxy floor-painting were measured according to corresponding GB/T, the result indicated that the solvent-free epoxy floor paint with low electronic impedance was completely qualified for industrial application.

  • 【网络出版投稿人】 浙江大学
  • 【网络出版年期】2007年 02期
  • 【分类号】TQ323.5
  • 【被引频次】4
  • 【下载频次】303
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