【作者】 杜宇；

【导师】 丛明；

【作者基本信息】 大连理工大学 ， 机械电子工程， 2006， 硕士

【摘要】 硅片预对准系统是一类面向集成电路制造业，在硅片传输过程中，补偿硅片机器人对硅片的定位误差，集机械、电子、光学、计算机等多学科于一体的，能够自动检测并精确定位硅片几何中心以及切边(或缺口)位置的高精度对准装置。 本文在充分研究国内外各种硅片预对准系统的基础上，研制了一种光学硅片预对准系统，它结构简单、成本低廉，具有较高的对准精度和一定的实用价值，能够完成对300mm大尺寸硅片的精确定位。论文首先提出了硅片预对准系统的总体设计方案和技术指标，然后根据设计要求，分章介绍了硅片预对准系统机械本体的设计，驱动与气动系统的设计，视觉系统的设计，以及控制系统的设计，最后对系统进行了误差分析。 在机械本体的设计中，采用滚珠螺杆花键的特殊传动形式，在一根轴上实现了旋转和升降两个自由度的运动，使预对准系统的结构更加紧凑，并提高了系统的传动精度。在驱动与气动系统的设计中，应用步进电机加细分驱动器的驱动方式，既满足了精度要求，又提高了系统的性价比，运用直线步进电机作为水平对心单元的驱动部件，进一步简化了机构。在视觉系统的设计中，采用线阵光源、柱面透镜和线阵图像传感器设计了视觉系统的硬件平台，并进行了圆拟合算法的分析。在控制系统的设计中，选用PC+MPC07运动控制卡，搭建系统的运动控制平台，利用视觉处理系统实时转换并向PC机传输硅片的位置信息，控制步进电机转动，完成对硅片的精确定位。在系统的误差分析中，分别对系统的机械加工误差、驱动及传动误差、气动交换误差和视觉检测误差进行了分析计算，结果表明本文设计的硅片预对准系统可以达到各项技术指标的要求。 随着硅片直径的增大，由传输引起的硅片的定位误差，越来越难以满足加工工艺精度不断提高的发展趋势，特别是在我国尚无同类产品研制成功的情况下，研制具有自主知识产权的硅片预对准系统对推动我国IC装备制造业的发展将具有重要意义。更多还原

【Abstract】 The Wafer Prealigner for integrate circuit(IC) manufacturing, used for compensating the location error of wafer handling robot in wafer handling system, is a sort of high-precision alignment device integrated with the subjects of mechanics, electronics, optics and computer science, which can detect and locate automatically the geometrical center and the notch or flat of the wafer accurately.With respect to the Wafer Prealigner, based on the survey of current status, a kind of optical Wafer Prealigner with the characteristics of the simple structure, low cost, upper alignment precision, practicality is developed, which can accomplish the high-precision alignment of wafer with the dimension of 300mm. Firstly, the general design scheme and the performance indexes of the Wafer Prealigner are presented. Then, according to the design requirements, mechanical noumenon, driving and pneumatic system design, vision system design as well as the control system design of the Wafer Prealigner are introduced respectively. Finally, the error analysis of the Wafer Prealigner is performed.The ball screw spline is used in the mechanical noumenon design and this structure can realize the moments of two degree of freedom in one axis, which makes the structure of the Wafer Prealigner more compact and increases the transmission precision of the system. In the sections of the driving and pneumatic system design, step motor and micro step driver are selected, which not only satisfy the precision request, but also increase the performance of the system and reduce the cost. Linear step motor is used to drive the horizontal alignment cell, which makes the structure more simply. In the part of vision system design, the hardware platform is composed of linear array light, cylindrical lens and linear array image sensor, then the algorithm of circle fitting method is carried on. In the section of the control system design, PC+MPC07 is used and the location is informed to the PC according to the vision system and control the step motor to accomplish the accurate location. In the section of the error analysis, machining error, drive error, pneumatic exchange error and vision detecting error are calculated, and the results prove that all the indexes satisfy the design requirement of the Wafer Prealigner.Along with the accretion of wafer diameter, the error of linearity and angle location increases continually due to the handling process. It is hard to satisfy the increase of manufacture precision, especially under the circumstance that our country so far has no such kind of production. So it is significant to manufacture a kind of Wafer Prealigner with the更多还原