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SiCp/ZL101A非真空振动液相扩散连接下氧化膜去除工艺及机理研究

Study on Technology and Mechanism of Removing Oxide Film during Vacuum-Free Vibration Liquid Phase Diffusion Bonding of SiCp/ZL101A Composites

【作者】 赵婷

【导师】 杨士勤;

【作者基本信息】 哈尔滨工业大学 , 材料加工工程, 2006, 硕士

【摘要】 本文以SiCp/ZL101A铝基复合材料为研究对象,研究了非真空振动液相扩散连接条件下,振动过程中液态金属层的动态平衡保持条件及氧化膜的去除行为。分析了接头的界面特征及微观组织结构,利用半固态合金流变性能理论,摸索振动过程中焊料流动性变化规律及固相晶粒变化行为,初步探讨焊料失衡的原因及氧化膜去除的物理过程。研究界定了动态平衡与失衡的界限,通过试验测出了不同工艺参数条件下焊料动态平衡保持最大时间,研究了动态平衡保持最大时间随温度、焊料填充系数、振幅、频率的变化规律。利用半固态理论研究焊料微观组织变化规律。随着温度的升高,焊料相应的固相晶粒所占比例降低,晶粒体积减小且趋于圆整化,所以焊料粘度降低,抗变形能力降低,流动性变好;随着时间的增加,液态焊料固相分数逐渐减少,固相晶粒逐渐减小并圆整化,直至最后变成残留的微小晶粒;且振动过程中,边缘处的固相分数小于中心处,导致边缘流动性好于中心。研究振幅、频率、时间对氧化膜去除的影响。其他工艺参数相同条件下,在焊料填充系数为0.85,当振幅为700μm时界面存在的氧化皮相对较少;随着振动频率的增加,界面处存在的氧化皮减少;随着振动时间的延长,界面处存在的氧化皮减少。在试验的基础上,利用半固态理论初步建立了氧化膜去除的物理模型。

【Abstract】 Dynamic equilibrium process for pushing and drawing in of part of filler metal at the edge of gap and removing behavior of oxide film were investigated during vacuum-free vibration liquid phase diffusion bonding, taken particulate-reinforced SiCp/ZL101A composites as the research object. Removing oxide film and microstructure of the joint were analyzed. Furthermore, the rheological behavior during vibration was discussed through the semi-solid alloys theory, in order to discuss the reason of the disequilibrium and the physical process of removing oxide film preliminary.This paper discussed the regularity of the maximum time of dynamic equilibrium maintain following with the temperature, filling coefficient of the solder, vibration amplitude and frequency.With temperature rising, the proportion of the solid crystal grain decreases, the solid crystal grain approaches to round and the size decreases, so the non-deformability decreases and the liquidity increases. With time rising, the proportion of the grain decreases, the solid crystal grain approaches to round and the size decreases, and the grain change into little crystal grain at last. During the vibration, the solid proportion of the center is more than the edge, so the marginal liquidity is better than the center.When the filling coefficient of the solder is 0.85, the oxide film remained in interface is least when vibration amplitude is 700μm; With frequency rising, the remained oxide film in interface decreases; With time rising, the remained oxide film in interface decreases. Physical model of the disruption of the oxide layer is established based on the experimental results.

  • 【分类号】TB331
  • 【被引频次】4
  • 【下载频次】177
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