【作者】 张永涛；

【导师】 梁伟； 侯文义； 赵兴国；

【作者基本信息】 太原理工大学 ， 材料加工工程， 2006， 硕士

【摘要】 使用20世纪80年代自制的电弧离子镀装置，进行了2Cr13／45钢及QA19-4／Cu、试样温度＜600℃的两种同基合金低温电弧离子镀研究。试验结果表明：①两种镀层都有厚约2～3μm的过渡层，从而使镀层-基材呈类冶金结合。延长施镀时间，在沉积层增厚的同时，过渡层也有所增厚。②沉积层化学成分与靶材基本相同。与异质合金沉积的重大区别在于沉积层相当于外延增厚的渗金属层(2Cr13／45钢离子镀沉积层相当于45钢表面渗Cr；QA19-4／Cu离子镀沉积层相当于纯铜的Al、Fe共渗层)。③由于离子镀可在低于基材相变点的温度下进行，基材组织和性能在施镀过程中基本不变，镀后不需要进行后续热处理，工件畸变量小。加之镀层较厚，即使磨削，也不会使改性层失效，从而消除了离子渗金属难以克服的弱点。④沉积速率与工艺参数及镀材熔点有关。沉积速率随弧电流的增大线性提高并随试样与靶面距离的缩短而提高。QA19-4／Cu电弧离子镀沉积速率高达1.58μm／min。⑤考虑到渗金属层必然存在的成分梯度，有效改性层仅是渗层的一部分，而同基合金离子镀层基本上全部为有效改性层。⑥沉积层晶粒细小并且其成分可通过调整靶材成分控制，甚至可以实现渗金属难于进行的超饱和渗(如QA19-4／Cu沉积层)。这种工艺更多还原

【Abstract】 The mechanism of arc ion plating (AIP) of the same basic component for both deposited layer and substrate (2Cr13 on steel 45 and QAl9-4 on copper) with the substrate temperature below 600℃ was invesgated and the experiments were carried out on a self-made AIP device of 1980’s. It was shown that: (1) There exists the transition layer with the thickness about 2~ 3μm in the two platings and the quasi-metallurgy adherence is formed between the deposited layer and the substrate. The longer the depositing time is , the thicker the deposited layer and the transition layer become. (2) The composition of the deposited layer is similar to that of the plating and what’s more , the significant distinction from the different base surface alloying lies on that the deposit layer can be regarded as more thicker extended diffusion layer (just like Cr is permeated on the surface of steel 45 and Al&Fe on the surface of copper) .(3) The process being carried out below the temperature of phase transformation, the microstructure and properties of substrate are not transformed with little distortion and no additional heat-treatment. By reason更多还原