【作者】 黄蕊慰；

【导师】 魏昕；

【作者基本信息】 广东工业大学 ， 机械制造及其自动化， 2006， 硕士

【摘要】 内圆锯切加工是整个硅晶片加工过程中的一道关键工序,其加工质量将影响到后续的研磨、抛光和刻蚀等工序的加工效率甚至影响到半导体器件的最终质量。对内圆锯切过程内圆锯片的受力状况及影响因素进行深入的分析研究,进一步了解影响内圆锯切的规律,将有助于对内圆锯切理论和技术的进一步完善,有助于改善和优化锯切加工条件,提高锯切加工质量和降低生产成本。本文理论分析了内圆锯切的锯切力、内圆锯片应力分布状态、内圆锯片张紧力作用下的特性以及内圆锯片的磨损机理。 1.从单颗金刚石磨粒受力角度出发,理论推导了内圆锯片锯切力公式。分析了内圆锯切力的特征,以及锯切工艺参数和工件尺寸变化对锯切力的影响。 2.对内圆锯片在初始张紧力作用下、空转状态下和锯切力作用下的应力进行了求解,分析了内圆锯片的应力分布状态,以及锯切工艺参数对锯片应力分布状态的影响。 3.采用有限单元法对内圆锯片在初始张紧力作用下的特性进行了分析,分析了均匀和非均匀张紧力作用下内圆锯片的变形、应力分布状态、自然频率和模态振型。 4.采用扫描电镜(SEM)对内圆刀刃磨损区域进行了微观形貌观察,分析了内圆刀刃的磨损机理,以及初始张紧对刀刃磨损的影响。更多还原

【Abstract】 ID slicing is an important process of the whole wafer processing. The subsequent produce efficiency of lapping, polishing and the final quality of IC will be impacted by the quality of sliced wafer greatly. The stress condition of ID blade and its influence factors are analyzed in the process of ID slicing. Thus, the rule of ID slicing will be further understood, which will contribute to improving the theory and technology of ID slicing, improving and optimizing the conditions of slicing, and improve the processing quality and reducing the production cost. Sawing force, stress state, initial tension, and blade wear have been studied systematically in this paper.1. Base on the force point of one diamond, the formula of ID sawing force was studied. The characteristic of sawing force and the influence of sawing parameter and workpiece on sawing force were analyzed.2. The stress distribution of ID blade about initial tension force, centrifugal force, and sawing force were studied. The influence of sawing parameter on the stess state of ID blade was investigated.3. The deflection, stress distribution, natural frequency and vibration mode of ID blade under uniform tension or uneven tension were investigated with finite element analysis.4. The topographies of blade wear surface were observed by means of scanning electronic microscope, and the wear mechanism of blade and the influence of initial tension on blade wear were analyzed.更多还原