【作者】 杜红越；

【导师】 韩雁；

【作者基本信息】 浙江大学 ， 微电子学与固体电子学， 2004， 硕士

【摘要】 本文是关于一种专用于名片交换的红外数据通信芯片的研制。 随着经济的发展，商务活动的增多，人们要保存和管理大量的名片，现有的名片管理方法不能很好地解决这个问题。与名片相关设备，或者存在管理方法复杂的缺点，或者不易携带，再者因为都是作为通讯、管理系统的附带功能，只能实现本产品间的名片交换。本文就此问题提出了“红外名片交换专用芯片”的概念，该芯片采用点对点红外通信的技术特点，结合系统集成方法，简化交换操作，增强了交换的安全性和通讯质量，并提高了名片管理的水平和效率。 该“红外名片交换专用芯片”能独立完成名片交换和管理的任务，具有显著优点： 1．采用红外数据通信的方式，具有技术方案成熟，交换方法简单，保密性好，相互电磁干扰小，成本低、简单易用等优点。 2．其采用同步接收的接收方法，提高了噪声抑制，保证接收质量。 3．采用简单指令集的设计，能在系统内完成全部的交换、存储，编辑、查询、修改名片等操作。 4．根据名片交换系统的特点，键盘电路采用中断检测的实现方案，较传统的轮询方案节省了系统工作时间，降低了功耗。 本芯片采用数模混合设计，参加了由上海集成电路中心(ICC)组织的MPW(多晶圆)计划，在无锡上华半导体有限公司流片，采用上华0.6um混合CMOS工艺(准双阱、双层多晶硅、双层金属)。测试芯片分为发送芯片和接收芯片两块，各为2×2mm~2，并进行了封装和测试。更多还原

【Abstract】 This paper introduces the development of a new type of special business card chip, which adopts infrared wireless data transmission technology.With the progress of economy, plenty of time is wasted in managing business cards for intercourses. Nowadays there are no efficient methods to resolve it. All of those have this and that kind of shortcomings, such as complex operation, incapable of taking on hand, and so on. Especially, the function of exchanging and managing business cards is accessory to the main systems, so it only works among same products.Since these disadvantages, This Paper gives the new concept called Special IR Business Card Exchanging Chip or Business Card Chip. The new chip can improves the efficiency of business cards management, enforce the security and quality of receivers, and simplify the operation. Some features of this chip are listed below:Firstly, it opts for IR data transmit technology, so it have the advantages of little EMI, simple operation, low cost, etc.Secondly, the synchrony method makes it have good noise suppression and BER quality.Thirdly, RISC design can support all function of exchanging, storing, editing, searching, and modifying the business cards.Fourthly, new type of keyboard circuits designed in this chip can save the system working time and reduce the power dissipation according to usual polling circuits.The chips are on two die of 2*2 mm2 using 0.6um CMOS mix-signaltechnology (double well, double poly, double metal) including sending part and receiving one respectively. The tests are also accomplished.更多还原