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搅拌摩擦加工对耐高温SiC/Al复合材料组织及性能影响

Effects of Friction Stir Processing on the Microstructure and Properties of Heat-resistant SiC/Al Composite

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【作者】 郭明欣张士琦谭东胡红洁昝宇宁马凯刘振宇肖伯律马宗义

【Author】 GUO Mingxin;ZHANG Shiqi;TAN Dong;HU Hongjie;ZAN Yuning;MA Kai;LIU Zhenyu;XIAO Bolyu;MA Zongyi;Institute of Metal Research, Chinese Academy of Sciences;CRRC Qishuyan Institute Co.,Ltd.;

【通讯作者】 昝宇宁;

【机构】 中国科学院金属研究所中车戚墅堰机车车辆工艺研究所股份有限公司

【摘要】 针对Si C/Al复合材料搅拌摩擦加工工艺参数敏感的挑战,本研究以25%SiC(质量分数)+1.5%TiO2(质量分数)+1%CNT/Al(体积分数)-1%Cu(质量分数)为原料制备的复合材料为对象,探究搅拌摩擦加工行进速度对微观组织与力学性能的影响规律,为制动盘工艺优化提供依据。采用粉末冶金工艺制备基体材料,通过单道次搅拌摩擦加工(行进速度分别为50和100 mm/min)得到FSP50、FSP100试样。通过微观组织分析及拉伸性能测试,系统研究了搅拌摩擦加工行进速度对复合材料微观组织、室温及300℃拉伸性能的影响。结果表明,FSP通过剪切-流变协同作用促进Si C颗粒均匀分布;通过热-力耦合作用细化Al3Ti及Al2Cu颗粒尺寸;晶粒尺寸随行进速度增加而细化;FSP100通过细晶强化和组织均匀化提升室温强度,抗拉强度达407 MPa;300℃下基体软化与界面退化导致复合材料强度下降;FSP引入的细小Si C颗粒界面在高温下更易发生脱粘。

【Abstract】 To address the challenge of determining the process parameter sensitivity in friction stir processing(FSP) of SiC/Al composites, this study investigated the influence of travel speed on the microstructure and mechanical properties of a 25 wt.% SiC+1.5 wt.% TiO2+1 vol.% CNT/Al-1 wt.% Cu composite, aiming to provide a theoretical basis for optimizing the manufacturing process of brake discs. The base material was fabricated via powder metallurgy, and single-pass FSP was subsequently conducted using travel speeds of 50 mm/min(sample FSP50) and 100 mm/min(sample FSP100). Through microstructural characterization and tensile testing, a systematic analysis was conducted to evaluate the influence of travel speed on the microstructure and tensile properties at both room temperature and 300 ℃. The results indicate that FSP promotes a homogeneous distribution of SiC particles through the combined effects of shear and rheological flow; the thermomechanical coupling during FSP effectively refines the Al3Ti and Al2Cu particles, and the grain size decreases with increasing FSP travel speed. FSP100 exhibits an enhancement in room-temperature tensile strength, reaching 407 MPa,which is attributed to increased grain boundary strengthening and improved microstructural homogeneity; at 300 ℃, the composite strength decreases due to matrix softening and interfacial degradation. The fine SiC particle-Al interfaces introduced by FSP are more susceptible to debonding under high-temperature conditions.

【基金】 国家重点研发计划(2023YFB3710601)
  • 【文献出处】 铸造技术 ,Foundry Technology , 编辑部邮箱 ,2026年05期
  • 【分类号】TB333
  • 【下载频次】18
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